Wiring circuit board

TW202640943APending Publication Date: 2026-10-01NITTO DENKO CORP
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Patent Information

Application Number
TW114148428
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-17
Filing Date
2025-12-10
Publication Date
2026-10-01

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  • Figure TWG2TA001078755_001
    Figure TWG2TA001078755_001
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    Figure TWG2TA001078755_002
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    Figure TWG2TA001078755_003
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Abstract

The wiring circuit board 1 of the present invention includes a metal support layer 11, a first insulating layer 12, and wirings 133A and 133B. Wiring 133A has a first outer edge E21 and a first inner edge E22. Wiring 133B has a second outer edge E31 and a second inner edge E32. At least one of the first outer edge E21 and the second outer edge E31 does not overlap with the metal support layer 11 in the thickness direction. The first inner edge E22 and the second inner edge E32 overlap with the metal support layer 11 in the thickness direction.
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