Printed circuit board with embedded SMD device
TW202640948APending Publication Date: 2026-10-01LITTELFUSE SEMICON WUXI
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Patent Information
- Application Number
- TW115106683
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-18
- Filing Date
- 2026-02-25
- Publication Date
- 2026-10-01
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Figure 00000000_0000_ABST
Abstract
A printed circuit board (PCB) assembly is disclosed. The printed circuit board assembly may include a PCB body, as well as a set of vias, disposed within the PCB body. The printed circuit board assembly may further include a set of devices, disposed within the set of vias, respectively.
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