Circuit module, circuit board, electronic device, and package module

Abstract

The present invention provides a circuit module, a circuit board, an electronic device, and a package module. The circuit board includes two first metal pads and two second metal pads that respectively correspond in position to the two first metal pads. Each of the two first metal pads and the corresponding second metal pad jointly define a first initial creepage path therebetween, and the two second metal pads jointly define a second initial creepage path therebetween. The circuit board has a first penetrating slot and a second penetrating slot that is located between the two second metal pads. Each of the two first metal pads and the corresponding second metal pad are spaced apart from each other through the first penetrating slot so as to jointly define a first extension creepage path. The two second metal pads are spaced apart from each other through the second penetrating slot so as to jointly define a second extension creepage path.

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