Method for mass manufacturing surface-mount transient power suppression elements and the elements thereof

Abstract

A method for mass-producing surface-mount transient power suppression elements includes: providing a sacrificial substrate film; forming a conductive metal thin film on the sacrificial substrate film; removing the connecting portions in the conductive metal thin film to form a plurality of pad electrode film assemblies; correspondingly welding a plurality of transient power suppression element bodies to each pad electrode film assembly, wherein each transient power suppression element body has at least one high-energy-conducting grain and a plurality of electrodes correspondingly welded to the pad film, and the pad film size is larger than the electrode size; filling a mold cavity with molten protective material; placing the sacrificial substrate film upwards and inserting a predetermined number of transient power suppression element bodies into the mold cavity, such that the transient power suppression element bodies are covered by the molten protective material to form a coated protective layer; removing the sacrificial substrate film to expose the pad electrode film assemblies; and granulation.

Images