Method for printing conductive paste

Abstract

The disclosure provides a method for printing conductive paste. By utilizing a transfer substrate and a laminating fixture, the conductive paste is first applied on the paste application area of the transfer substrate, while other components are accommodated in the clearance area of the transfer substrate. Then, the laminating fixture ensures sufficient contact between the conductive paste and the solder pads on the circuit board, allowing the conductive paste to be fully transferred onto the solder pads, thus completing the printing of conductive paste on the solder pads and solving the problem of difficulty in printing conductive paste when the PCB has an irregular shape or when the paste application surface is not coplanar with other components. The conductive paste printing method of this disclosure employs an automated production line approach, making the operation standards more standardized, scientific, and institutionalized, ensuring process stability throughout the entire workflow and possessing broad market prospects.

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