Circuit board structure and manufacturing method thereof

TW202640952AInactive Publication Date: 2026-10-01NAN YA PRINTED CIRCUIT BOARD CORPORATION
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Patent Information

Application Number
TW114110213
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-19
Publication Date
2026-10-01
Estimated Expiration
Not applicable · inactive patent

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Abstract

A circuit board structure and a manufacturing method thereof are provided. The circuit board structure includes a substrate, a solder mask, a first solder bump, a second solder bump and a flux layer. The solder mask is disposed over the substrate and includes a first opening and a second opening, wherein an aperture of the first opening is smaller than that of the second opening. The first solder bump is filled into the first opening of the solder mask and protrudes from the top surface of the solder mask. The second solder bump is filled into the second opening of the solder mask and protrudes from the top surface of the solder mask. The flux layer covers the surface of each of the first and the second solder bump exposed by the solder mask.
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