Circuit board device

Abstract

A circuit board device includes a multilayer board structure and differential pair routings. Each of the differential pair routings includes two plate layers and a core layer sandwiched between the plate layers. The circuit module includes a first PTH and a second PTH. The first PTH includes a first conductive hole and a first laser through hole, and the first laser through hole is electrically connected to the first conductive hole. The second PTH includes a second conductive hole and a second laser through hole. The first conductive hole and the second conductive hole are located in the core layer. The second laser through hole is electrically connected to the second conductive hole. The first conductive hole is parallel to the second conductive hole and a first distance is formed between the first conductive hole and the second conductive hole. The first conductive hole and the second conductive hole are completely located between the imaginary extension lines of the first conductive hole and the second conductive hole, and a second distance between the first laser through hole and the second laser through hole that is smaller than the first distance.

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