Module card as well as combination of module card and slot

Abstract

The present invention provides a module card and a combination of the module card and a slot. The module card of the present invention includes a substrate, a first die, a second die, an adhesive, a plurality of metal contacts, a heat-conducting layer and a heat-conducting material. The substrate has a first surface and a second surface opposite to each other. A plurality of holes is formed in the substrate. The holes penetrate the substrate from the first surface to the second surface. The first die and the second die are disposed on the first surface of the substrate. The adhesive is arranged to attach the second die to the first surface of the substrate. The metal contacts are arranged on the second surface of the substrate. The heat-conducting layer is disposed on the second surface of the substrate. The heat-conducting material is filled in the holes and is in contact with the adhesive and the heat-conducting layer.

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