Heat-dissipating structure and electronic device

Abstract

A heat-dissipating structure includes a main body and a flow-accelerating member. The main body includes an inner wall and has a flow channel. The flow channel is located insides the inner wall and extended along a first direction. The flow channel includes a first air inlet and an air outlet relative to each other and an accelerating segment located between the first air inlet and the air outlet. The flow-accelerating member is movably disposed on the inner wall and located at the accelerating segment. When a temperature of the flow channel is getting higher, the flow-accelerating member is adapted to transform from a first status to a second status, to make a width of the accelerating segment become smaller. An electronic device is also provided.

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