Semiconductor device and manufacture method thereof

Abstract

A semiconductor device is provided, including: a substrate, a conductive contact, a metal plate, an array structure and a plurality of circuit structures. The substrate includes an array portion and a plurality of circuit portions neighboring to the array portion, wherein the array portion is located in an array area, and the plurality of circuit portions is located in a plurality of circuit areas. The conductive contact is disposed over the substrate. The metal plate is disposed on the conductive contact. The array structure is disposed over the metal plate. A plurality of circuit structures is disposed neighboring to the array structure. A method of manufacturing a semiconductor device is further provided.

Images