Semiconductor wafer and method of manufacturing semiconductor device

Abstract

A semiconductor wafer includes a semiconductor substrate, a plurality of chip regions, a scribe region, and an interlayer insulating film. A TEG is formed in the scribe region. The TEG includes a first active region formed in the semiconductor substrate, a second active region formed in the semiconductor substrate, and adjacent to the first active region in a first direction, a gate electrode formed on the first active region and the second active region, and extending in the first direction, an insulating region adjacent to the second active region in a second direction orthogonal to the first direction, and formed in the semiconductor substrate so as not to overlap with the first gate electrode in plan view, a plug formed in the interlayer insulating film and connected to the first active region, and a dummy plug formed in the interlayer insulating film and connected to the insulating region.

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