Semiconductor device and method of manufacturing the same

TW202641011APending Publication Date: 2026-10-01RENESAS ELECTRONICS CORP
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Patent Information

Application Number
TW114143402
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-11
Filing Date
2025-11-07
Publication Date
2026-10-01

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    Figure TWG2TA001078445_003
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Abstract

A gate electrode is formed on a semiconductor substrate via a second gate insulating film, and a floating gate electrode is formed on the semiconductor substrate via a first gate insulating film. A second sidewall spacer is formed on a side surface of the gate electrode, and a first sidewall spacer is formed on a side surface of the floating gate electrode. A first insulating film made of silicon oxide covers the floating gate electrode, and a second insulating film made of silicon nitride covers the gate electrode, the floating gate electrode, the second sidewall spacer, the first sidewall spacer, and the first insulating film. The first insulating film is interposed between an upper surface of the floating gate electrode and the second insulating film. A density of the upper portion of the first insulating film BL is larger than that of the lower portion of the first insulating film.
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