RRAM memory cell structure

TW202641032APending Publication Date: 2026-10-01SILICON STORAGE TECHNOLOGY INC
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Patent Information

Application Number
TW115103920
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-06-02
Filing Date
2026-02-02
Publication Date
2026-10-01

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    Figure TWG2TA001079258_003
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Abstract

A resistive random access memory (RRAM) memory cell structure includes a transistor formed on a semiconductor substrate and includes a source region, a drain region and a gate, a lower electrode disposed over the semiconductor substrate and electrically connected to the drain region, a source line electrically connected to the source region, a word line electrically connected to the gate, first and second blocks of resistive switching dielectric material electrically connected to the lower electrode, a first upper electrode electrically connected to the first block of resistive switching dielectric material, a second upper electrode electrically connected to the second block of resistive switching dielectric material, and first and second bit lines electrically connected to the first and second upper electrodes respectively. The first bit line and the second bit line are electrically isolated from each other except for the first and second blocks of resistive switching dielectric material.
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