Integrated chip and method of forming the same
TW202641078APending Publication Date: 2026-10-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Application Number
- TW114116918
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-19
- Filing Date
- 2025-05-06
- Publication Date
- 2026-10-01
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Figure TWG2TA001078115_001 
Figure TWG2TA001078115_002 
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Abstract
The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a gate structure over a substrate and a channel structure over the gate structure. A first source / drain contact and a second source / drain contact are disposed over the channel structure and the gate structure. The first source / drain contact is laterally separated from the second source / drain contact along a first direction. A capacitor is electrically coupled to the first source / drain contact. The first source / drain contact has a first length and the second source / drain contact has a second length measured along a second direction that is substantially perpendicular to the first direction. The first length is different than the second length.
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