Semiconductor substrates and their manufacturing methods, semiconductor substrate manufacturing apparatus, and semiconductor devices

TW202641081APending Publication Date: 2026-10-01KYOCERA CORP
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Patent Information

Application Number
TW115124575
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-12-01
Filing Date
2024-11-29
Publication Date
2026-10-01

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Abstract

The semiconductor substrate includes a template substrate and a first semiconductor portion located above a first seed region and a growth inhibition region. The first semiconductor portion includes a first wing located above the aforementioned growth inhibition region. The first wing has a first nitride semiconductor layer, an aluminum-based semiconductor layer located on the first nitride semiconductor layer, and a second nitride semiconductor layer located on the aluminum-based semiconductor layer. The upper surface of the second nitride semiconductor layer has a lower silicon concentration compared to the upper surface of the first nitride semiconductor layer.
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