Semiconductor substrates and their manufacturing methods, semiconductor substrate manufacturing apparatus, and semiconductor devices
TW202641081APending Publication Date: 2026-10-01KYOCERA CORP
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Patent Information
- Application Number
- TW115124575
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-12-01
- Filing Date
- 2024-11-29
- Publication Date
- 2026-10-01
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Abstract
The semiconductor substrate includes a template substrate and a first semiconductor portion located above a first seed region and a growth inhibition region. The first semiconductor portion includes a first wing located above the aforementioned growth inhibition region. The first wing has a first nitride semiconductor layer, an aluminum-based semiconductor layer located on the first nitride semiconductor layer, and a second nitride semiconductor layer located on the aluminum-based semiconductor layer. The upper surface of the second nitride semiconductor layer has a lower silicon concentration compared to the upper surface of the first nitride semiconductor layer.
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