Semiconductor device and method of manufacturing semiconductor device

TW202641100APending Publication Date: 2026-10-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
TW114119550
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-27
Filing Date
2025-05-23
Publication Date
2026-10-01

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    Figure TWG2TA001078163_003
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Abstract

An embodiment semiconductor device includes a substrate, a first plurality of functional gate structures within a first circuit area over the substrate, a first plurality of dummy gate structures adjacent to the first circuit area over the substrate, a second plurality of functional gate structures within a second circuit area over the substrate, and a second plurality of dummy gate structures adjacent to the second circuit area over the substrate. The first average height and the second average height are different.
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