Semiconductor device and method of manufacturing semiconductor device
TW202641100APending Publication Date: 2026-10-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Application Number
- TW114119550
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-27
- Filing Date
- 2025-05-23
- Publication Date
- 2026-10-01
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Abstract
An embodiment semiconductor device includes a substrate, a first plurality of functional gate structures within a first circuit area over the substrate, a first plurality of dummy gate structures adjacent to the first circuit area over the substrate, a second plurality of functional gate structures within a second circuit area over the substrate, and a second plurality of dummy gate structures adjacent to the second circuit area over the substrate. The first average height and the second average height are different.
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