Manufacturing method, cleaning solution and cleaning method of LED mounting substrate
TW202641130APending Publication Date: 2026-10-01SHIN ETSU CHEMICAL CO LTD
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Patent Information
- Application Number
- TW115125213
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2022-07-06
- Filing Date
- 2023-07-05
- Publication Date
- 2026-10-01
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Abstract
This invention discloses a method for manufacturing an LED mounting substrate, comprising the step of cleaning an LED chip transferred from a sapphire substrate to a receiver substrate by laser stripping using an alkaline cleaning solution. Accordingly, this invention provides a method for manufacturing an LED mounting substrate capable of selectively removing Ga metal attached to an LED chip transferred from a sapphire substrate to a receiver substrate by laser stripping without dissolving or modifying other metals; a cleaning solution applicable thereto; a cleaning method for selectively removing gallium attached to an LED chip without dissolving or modifying other metals; and a cleaning method for selectively removing gallium from parts having gallium and metals other than gallium on their surface without dissolving or modifying the metals other than gallium.
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