Composite wafers, methods for manufacturing composite wafers

TW202641163APending Publication Date: 2026-10-01NGK INSULATORS LTD
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Patent Information

Application Number
TW114151382
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-28
Filing Date
2025-12-26
Publication Date
2026-10-01

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Abstract

The object of this invention is to implement marking without reducing the effective area in a composite wafer formed by bonding a functional substrate and a support substrate. The solution is a composite wafer 100 comprising: a functional substrate 10 made of a functional material and a support substrate 20 made of a semiconductor material and bonded to the functional substrate 10 to support it. A step is formed at the outer edge of the composite wafer 100, and a region 21 is formed below this step, which has a marking area 51 marked with specific text or symbols.
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