Methods for oxidizing a substrate surface using gas phase oxidizing radicals

TW202641170APending Publication Date: 2026-10-01TOKYO ELECTRON LTD
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Patent Information

Application Number
TW114143688
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-12
Filing Date
2025-11-10
Publication Date
2026-10-01

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Abstract

Various embodiments of methods are provided herein for oxidizing a surface of a semiconductor substrate. In the disclosed embodiments, gas-phase oxidizing free radicals are generated and used to oxidize an exposed surface of a material and form a thin oxide film there on. The gas-phase oxidizing free radicals are generated via ultraviolet (UV) photolysis of vaporized peroxide solutions. In some embodiments, an aqueous hydrogen peroxide (H2O2) solution is vaporized and photolyzed with UV light to form gas-phase hydroxyl (HO*) free radicals, which oxidize the exposed surface of the material to form a thin oxide film on the exposed surface of the material.
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