Manufacture method for manufacturing a wafer structure

TW202641172APending Publication Date: 2026-10-01OKMETIC OY
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Patent Information

Application Number
TW114150207
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-19
Filing Date
2025-12-19
Publication Date
2026-10-01

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Patent Text Reader

Abstract

to produce the wafer structure. The wafer structure comprises the trap-rich layer bonded against the handle wafer so that a grain structure in the trap-rich layer is coarser adjacent to the handle wafer and a grain size in the grain structure decreases away from the handle wafer to improve a trapping efficiency of the wafer structure in the trap-rich layer in an interface (IF) towards the top wafer.
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