Method for producing laminate substrate, and substrate processing device

Abstract

A method for preparing a laminate substrate of the invention includes the following steps (A) to (D). (A) A joining layer that includes an oxide layer is formed on the surface of a first semiconductor substrate. (B) The oxide layer of the joining layer is brought into contact with a second semiconductor substrate, thereby joining the first semiconductor substrate and the second semiconductor substrate via the joining layer. (C) After joining the substrates, a modified layer is formed by a laser beam on a first intended division surface where the first semiconductor substrate is intended to be divided in the thickness direction. (D) The first semiconductor substrate joined to the second semiconductor substrate via the joining layer is reduced in thickness by dividing the first semiconductor substrate along the modified layer formed on the first intended division surface.

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