Film forming method and film forming apparatus

TW202641185APending Publication Date: 2026-10-01TOKYO ELECTRON LTD
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Patent Information

Application Number
TW115107954
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-19
Filing Date
2026-03-05
Publication Date
2026-10-01

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Abstract

A film-forming method according to one aspect of the present disclosure includes the following steps: (a) storing a first raw material gas containing a first element and a second raw material gas containing a second element different from the first element in a first storage tank disposed in a first flow path, and then supplying it to a processing container through the first flow path; and (b) supplying a reaction gas containing a third element to the processing container, forming a film containing the first element, the second element and the third element on a substrate disposed in the processing container, and disposing of a second flow path connected to the upstream side of the first storage tank of the first flow path. In step (a), the second raw material gas is stored in a second storage tank disposed in the second flow path and then supplied to the first storage tank through the second flow path.
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