Rotated 3D dram cell
TW202641193APending Publication Date: 2026-10-01APPLIED MATERIALS INC
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Patent Information
- Application Number
- TW114138760
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-17
- Filing Date
- 2025-10-08
- Publication Date
- 2026-10-01
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Figure TWG2TA001078337_001 
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Abstract
crystal direction of the semiconductor wafer prior. An epitaxial stack is formed on the semiconductor wafer, and a slit is etched through the epitaxial film stack to expose a sidewall of the epitaxial film stack. The sidewall of the epitaxial film stack is oriented along a plane of the epitaxial film stack that is aligned from
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