Treatment methods and plasma treatment systems

TW202641200APending Publication Date: 2026-10-01TOKYO ELECTRON LTD
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Patent Information

Application Number
TW115124890
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2021-08-03
Filing Date
2022-08-02
Publication Date
2026-10-01

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Abstract

A processing method for plasma treatment of a substrate includes the following steps: placing a temperature-adjustable object on a mounting surface of a substrate support portion configured within a processing container capable of depressurization; forming a heat transfer layer for the temperature-adjustable object on the mounting surface of the substrate support portion, the heat transfer layer being composed of and freely deformable of at least one of a liquid layer or a freely deformable solid layer; and performing plasma treatment on the substrate on the mounting surface on which the heat transfer layer is formed.
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