Cutting device and cutting depth setting method

Abstract

[Problem] Properly setting the dicing depth when dicing wafers. [Solution] A first table height distribution map is generated by contact measurement of the table height. A main height distribution map is generated by non-contact measurement of the main height. Based on the main height distribution map and the known thickness of the main substrate, a second table height distribution map is generated, showing the height distribution of the table. After completing the above preparations, a first height distribution map is generated by non-contact measurement of the wafer height. The wafer thickness distribution is determined using the first height distribution map and the second table height distribution map. Based on the first table height distribution map and the wafer thickness distribution, a second height distribution map showing the wafer height distribution is generated. The dicing depth is set based on this second height distribution map. none

Images