Substrate processing method and substrate processing apparatus

TW202641214APending Publication Date: 2026-10-01DAIKIN FINETECH LTD
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Patent Information

Application Number
TW115101953
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-23
Filing Date
2026-01-19
Publication Date
2026-10-01

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Patent Text Reader

Abstract

The substrate processing method according to the present invention includes: a step of preparing a substrate (91) having a surface (911) and a back surface (912) and having a cover (93) deposited on the surface (911); a step of introducing a processing liquid (92) between the back surface (912) and the vibration generating part (81) with the back surface (912) facing each other; and a step of peeling the cover (93) off the surface (911) by generating vibration from the vibration generating part (81). With such a structure, a suitable peeling process can be achieved while suppressing damage to the substrate surface.
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