Substrate processing method and substrate processing system

TW202641217APending Publication Date: 2026-10-01TOKYO ELECTRON LTD
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Patent Information

Application Number
TW115122735
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2020-01-28
Filing Date
2020-12-14
Publication Date
2026-10-01

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Abstract

A method of transferring a device layer formed on a surface of a second substrate to a first substrate in a composite substrate in which the first substrate and the second substrate are bonded together, wherein a pulsed laser light is irradiated from the rear surface side of the second substrate onto a laser absorbing layer formed between the second substrate and the device layer.
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