Method for manufacturing electronic device

TW202641219APending Publication Date: 2026-10-01MITSUI CHEM ICT MATERIA INC
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Patent Information

Application Number
TW115111965
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-27
Filing Date
2026-03-27
Publication Date
2026-10-01

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    Figure TWG2TA001079684_003
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Abstract

that includes a base material layer (A) and an adhesive resin layer (B) and a workpiece temporarily fixed to the adhesive resin layer (B); and a processing process of processing the workpiece that is temporarily fixed to the adhesive resin layer (B), in which the arithmetic average roughness (Ra) of the adhesive film
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