Semiconductor devices, methods for manufacturing semiconductor devices

Abstract

The objective of this invention is to prevent the adhesion of cutting tape shavings as dust to semiconductor devices, thereby preventing a decrease in the yield of semiconductor devices caused by dust adhesion. The semiconductor device of this invention comprises: a semiconductor layer; and an external electrode layer, which is a layer deposited with an insulating layer separating the semiconductor layer from the semiconductor layer, having a plurality of external electrodes for electrical connection with external devices, and an organic insulating film covering the sides of the external electrodes; and at least a portion of the sides of the external electrode layer exposes inorganic material.

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