Wafer processing equipment and adjustment methods

Abstract

This disclosure provides a wafer processing apparatus and adjustment method, belonging to the field of semiconductor manufacturing. The wafer processing apparatus includes a clamping member for adjusting the position of a wafer; an optical measuring member disposed on the clamping member for measuring measurement data of the wafer's center offset from the rotation center of the vacuum rotary table; and a processor configured to: calculate adjustment data of the wafer based on the measurement data, and send instructions to the clamping member to adjust the wafer so that the wafer is placed concentrically with the vacuum rotary table.

Images