Substrate processing device

Abstract

[Problem] This disclosure describes a substrate processing apparatus capable of suppressing the adhesion of foreign matter to the periphery of a substrate. [Solution] The substrate processing apparatus includes: a support portion configured to support a substrate; an annular member configured to surround the support portion from the periphery; an annular cover member configured around the annular member; a rotating portion configured to rotate the support portion; and a second supply portion. The cover member includes: a rectifying protrusion extending vertically opposite the periphery of the substrate supported on the support portion and located inside the annular member when viewed vertically; a horizontal portion extending horizontally above the annular member; and a sidewall portion extending vertically surrounding the outer peripheral surface of the annular member. The second supply portion is configured to supply cleaning fluid to the rectifying protrusion or the annular member.

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