Substrate cleaning apparatus, substrate cleaning method and control program
TW202641232APending Publication Date: 2026-10-01SHIBAURA MECHATRONICS CORP
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Patent Information
- Application Number
- TW115109337
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2026-01-30
- Filing Date
- 2026-03-13
- Publication Date
- 2026-10-01
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Abstract
This substrate cleaning apparatus improves the processing efficiency of substrate cleaning while suppressing substrate damage or backcontamination from the cleaning body. An embodiment of the substrate cleaning apparatus includes: a holding unit for holding the substrate; a supply unit for supplying cleaning liquid to the surface to be treated of the substrate; a cleaning unit for cleaning the surface to be treated by contacting the cleaning body; a measuring unit for measuring the amount of particles contained in the cleaning liquid discharged from the surface to be treated; and a control unit for controlling the contact load applied by the cleaning body to the surface to be treated based on the measured amount of particles.
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