Wafer drying device and operation method thereof

Abstract

The present application provides a wafer drying device and an operating method thereof. The wafer drying device includes a tank body, a placing platform, a drying platform, an external air source, and a wafer cassette. The external gas source is connected to the drying platform for providing drying gas. The wafer cassette is used to carry a plurality of wafers. The wafer cassette is disposed on the placing platform, and bottom ends of the wafers are placed against the drying platform, so that liquid attached to the bottom ends of the wafers is removed by the drying gas provided by the external gas source.

Description

[Technical Field]

[0001] This application relates to the field of semiconductor manufacturing, and in particular to a wafer drying apparatus and its operating method. [Previous Technology]

[0002] In semiconductor manufacturing, wafer drying is a crucial step that directly impacts process yield and final product quality. The drying effect not only determines the cleanliness of the wafer surface but also affects the stability and reliability of subsequent processes. However, current drying technologies still have some bottlenecks, affecting process efficiency and quality control.

[0003] Taking traditional hot nitrogen drying technology as an example, its operation process typically includes three main steps. First, in the wafer cleaning stage, the wafer and wafer boat are immersed in deionized water for cleaning to remove particles and chemical residues. Next, in the drainage stage, deionized water is discharged through the bottom of the tank, allowing the wafer to gradually detach from the liquid surface. Finally, during the drying process, hot nitrogen jets from both sides of the tank are used to blow on the wafer surface to remove residual moisture. However, this technology has significant bottlenecks and problems. Although hot nitrogen blowing can effectively evaporate moisture from the wafer surface, water droplets may still remain on the bottom of the wafer, preventing complete drying. This residual moisture will have a series of negative impacts on the process, including decreased process yield and deterioration of surface quality. The residue of water droplets may cause contamination, further affecting the stability of subsequent processes. In addition, non-uniform evaporation of water droplets may lead to watermarks or dry spots, resulting in a decrease in wafer surface quality and even affecting the electrical properties and reliability of components.

[0004] In view of this, it is necessary to provide a wafer drying apparatus and its operating method to solve the above-mentioned technical problems. [Summary of the Invention]

[0005] In order to solve the problems of the above-mentioned prior art, the purpose of this application is to provide a wafer drying apparatus and its operating method, which can achieve comprehensive drying of the bottom of the wafer.

[0006] In a first aspect, this application provides a wafer drying apparatus, comprising: a tank having a bottom wall, a plurality of side walls and an opening, wherein the side walls surround the bottom wall and the opening is disposed above the tank; a placement platform and a drying platform disposed near the bottom wall; an external gas source connected to the drying platform for providing a drying gas; and a crystal boat for carrying a plurality of wafers, wherein the crystal boat enters the tank through the opening and is placed on the placement platform, and the bottom ends of the wafers abut against the drying platform, so as to remove liquid adhering to the bottom ends of the wafers by means of the drying gas provided by the external gas source.

[0007] In some embodiments, the drying platform includes: an elongated rod extending along the arrangement direction of the wafers; an elongated groove formed on the surface of the elongated rod in contact with the wafers; and a gas channel communicating with the elongated groove and connected to an external gas source, wherein the drying gas provided by the external gas source is introduced into the elongated groove via the gas channel and applied to the bottom of the wafers to remove the liquid.

[0008] In some embodiments, the external gas source provides the dry gas with negative pressure.

[0009] In some embodiments, the external gas source provides the dry gas with positive pressure.

[0010] In some embodiments, the wafer drying apparatus further includes a plurality of jet devices disposed on the sidewalls, and the outlets of the jet devices are aligned with the wafers.

[0011] In a second aspect, this application also provides a method of operating a wafer drying apparatus, comprising: providing the wafer drying apparatus as described above; moving the wafer boat carrying the wafers through the opening into the tank and placing it on the placement platform, wherein the bottom ends of the wafers abut against the drying platform; injecting the liquid into the tank to immerse the wafers therein; draining the liquid; and removing the liquid adhering to the bottom ends of the wafers by means of the drying gas provided by the external gas source.

[0012] In some embodiments, the drying platform includes: an elongated rod extending along the arrangement direction of the wafers; an elongated groove formed on the surface of the elongated rod in contact with the wafers; and a gas channel communicating with the elongated groove and connected to an external gas source, wherein the method of removing liquid adhering to the bottom of the wafers by means of the drying gas provided by the external gas source includes: introducing the drying gas provided by the external gas source into the elongated groove through the gas channel and applying it to the bottom of the wafers to remove the liquid.

[0013] In some embodiments, the external gas source provides the dry gas with negative pressure, and the operation method includes removing the liquid adhering to the bottom of the wafers by means of the dry gas provided by the external gas source: removing the liquid from the bottom of the wafers by means of a pumping action.

[0014] In some embodiments, the external gas source provides the dry gas with positive pressure, and the operation method includes removing the liquid adhering to the bottom of the wafers by means of the dry gas provided by the external gas source: removing the liquid from the bottom of the wafers by means of airflow blowing action.

[0015] In some embodiments, the wafer drying apparatus further includes a plurality of jet devices disposed on the sidewalls, and the outlets of the jet devices are aligned with the wafers. After the liquid is discharged, the method of operation further includes: using the jet devices to blow air toward the surface of the wafers and generate a downward airflow.

[0016] Compared to previous technologies, this application introduces a drying platform, which brings the bottom of the wafer into contact with the drying platform and releases hot nitrogen gas at a controlled temperature evenly, ensuring that the airflow can fully cover the bottom of the wafer. This design not only effectively improves drying uniformity and avoids the problem of uneven drying in certain areas, but also accelerates the evaporation and removal of residual moisture at the bottom.

Implementation Method

[0017] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without making progressive efforts are within the scope of protection of this application.

[0018] In semiconductor manufacturing processes, wafer drying is a crucial step that directly impacts process yield and the quality of the final product. The effectiveness of wafer drying not only affects the cleanliness of the wafer surface but also profoundly influences the stability and reliability of subsequent processes. Incomplete drying, especially if water droplets on the wafer's bottom are not completely removed, can lead to process contamination, resulting in wafer surface defects or unstable electronic component performance, ultimately affecting overall yield. Therefore, achieving precise and efficient drying technology is essential for ensuring the high quality of semiconductor products. In view of the problem of incomplete removal of water droplets on the wafer's bottom in existing technologies, this application proposes an innovative wafer drying apparatus and its operating method to address this technical bottleneck, as detailed below.

[0019] Please refer to Figures 1 and 2. Figure 1 shows a schematic diagram of the wafer drying apparatus according to an embodiment of this application, and Figure 2 shows a perspective view of the wafer drying apparatus of Figure 1. The wafer drying apparatus 10 includes a tank 100, a fixing frame 200, a placement platform 300, a drying platform 400, a wafer boat 500, a plurality of jet devices 600, and an external air source. The wafer drying apparatus 10 of this application belongs to a batch-type wafer wet process equipment, mainly designed for batch cleaning and drying of multiple wafers. This device can process multiple wafers simultaneously, improving process efficiency and ensuring that each wafer achieves a high degree of cleanliness and high uniformity in drying. It is suitable for various cleaning and drying steps in semiconductor manufacturing processes, especially suitable for high-volume processes, effectively reducing the time cost of single-wafer processing, improving production efficiency, and ensuring the stability of subsequent processes and product yield.

[0020] As shown in Figures 1 and 2, the tank 100 mainly consists of a bottom wall 101, a plurality of side walls 102, and an opening 103. Its structural design aims to provide a stable processing space to facilitate wafer cleaning and drying operations. The side walls 102 surround the bottom wall 101 to form a containment space inside the tank 100, allowing the wafers and processing liquid to be effectively controlled within the tank. In addition, the opening 103 is located above the tank 100 and corresponds to the bottom wall 101, facilitating the entry and exit of the wafer boat along with the wafers.

[0021] As shown in Figures 1 and 2, the fixing frame 200 is disposed on the bottom wall 101 of the tank 100 and located inside the tank 100, providing a stable support structure for the placement platform 300 and the drying platform 400. Specifically, the fixing frame 200 consists of multiple bases and multiple long rods. The bases are correspondingly fixedly installed on the bottom wall 101 of the tank 100, while the long rods are arranged in a horizontal or vertical staggered manner and fixed to the corresponding bases or directly fixed to the bottom wall 101 to form a stable frame structure. This frame structure not only provides high-strength support, enabling the placement platform 300 and the drying platform 400 to be stably erected in the appropriate position, that is, set near the bottom wall 101 of the tank 100, but also ensures that they maintain an appropriate distance from the bottom wall 101 to optimize airflow circulation and improve drying efficiency and uniformity. In addition, the fixture 200 is highly modular and flexible in design, and can be adapted to different batch requirements and wafer sizes, ensuring that the device is applicable to various semiconductor processes and improving the adaptability and operating efficiency of the overall drying system.

[0022] As shown in Figures 1 and 2, the crystal boat 500 is designed to carry multiple wafers W, enabling them to undergo cleaning and drying processes simultaneously. To improve process efficiency, the crystal boat 500 has the ability to move relative to the tank 100 and can achieve precise positioning through a moving mechanism. Specifically, the moving mechanism can drive the crystal boat 500 into the tank 100 and can also remove it from the tank 100 after processing, ensuring that the wafers W can undergo each stage of the process stably and smoothly. When the crystal boat 500 enters the tank 100, it enters through the opening 103 and is placed on the placement platform 300, so that the bottom of the wafers W contacts the drying platform 400 to facilitate the drying process. Furthermore, in some embodiments, the drying platform 400 can slightly lift the wafers W, so that their bottoms are fully exposed to the airflow environment, avoiding the obstruction of airflow by the internal structure of the crystal boat 500. This significantly improves the uniformity and efficiency of airflow contact with the bottom of the wafer, promotes rapid evaporation of moisture, thereby improving the drying effect, reducing the impact of residual water droplets on subsequent processes, and ensuring wafer surface quality and process yield.

[0023] As shown in Figures 1 and 2, the jetting device 600, as the core drying mechanism inside the tank 100, is mainly used to quickly remove most of the residual liquid on the surface of the wafer W, ensuring the efficiency and uniformity of the drying process. These jetting devices 600 are disposed on the side walls 102 of the tank 100 and located inside the tank 100 to ensure that the airflow can directly act on the surface of the wafer W. In this embodiment, four sets of jetting devices 600 are configured inside the tank 100, respectively installed on the corresponding side walls 102, to achieve comprehensive airflow coverage of the wafer W. Each set of jetting devices 600 includes multiple gas outlets distributed along the wafer W's arrangement direction. These outlets are precisely aligned with the wafer W, allowing the airflow to be effectively applied to the wafer surface. When the drying process starts, the jetting device 600 releases a high-speed airflow and generates a directional, downward-sloping airflow to drive the liquid on the surface of the wafer W to flow in a specific direction, causing it to quickly detach from the wafer W surface. Furthermore, this airflow not only effectively reduces the amount of residual liquid on the wafer surface but also promotes uniform liquid discharge, further reducing the risk of watermarks, uneven drying, or particulate contamination. Through the design and configuration of this jet device, the efficiency and reliability of wafer drying can be significantly improved, ensuring the stability and high yield of subsequent processes.

[0024] Please refer to Figure 3, which shows a partial schematic diagram of the tank body according to an embodiment of this application. The drying platform 400 is designed to improve the drying efficiency of the bottom of the wafer W, and its main components include an elongated rod 401, an elongated groove 402, and a gas channel 403. The elongated rod 401 extends along the arrangement direction of the wafers W, ensuring that the bottom of all wafers W can stably contact the drying platform 400, achieving uniform airflow distribution and drying effect. When the crystal boat 500 enters the tank body 100 and is placed on the placement platform 300, the bottom of each wafer W will abut against the elongated rod 401, ensuring that the drying gas can directly act on the bottom of the wafer. To further improve the drying effect, the elongated rod 401 has an elongated groove 402 on the surface that contacts the wafer W, forming an airflow guiding area with the bottom of the wafer W. The gas channel 403 communicates with the elongated groove 402 and is connected to an external gas source to provide stable and controlled drying gas, such as hot nitrogen or other suitable inert gas, during the drying step. When the drying process is initiated, drying gas supplied by an external gas source is introduced into the elongated groove 402 through the gas channel 403 and evenly applied to the bottom of the wafer W to effectively remove residual liquid. This design not only accelerates the evaporation of moisture but also reduces the risk of watermarks or uneven drying, further improving wafer surface quality and process yield.

[0025] Please refer to Figure 4, which shows a first operational view of the drying platform according to an embodiment of this application. In some embodiments, an external air source provides drying gas with negative pressure to optimize the liquid removal efficiency at the bottom of the wafer W. When the drying process is started, the negative pressure environment generated by the external air source can form a local low-pressure zone near the drying platform 400. Through airflow drive and pressure difference, the liquid adhering to the bottom of the wafer W is quickly removed from the surface. Specifically, the negative pressure drying mechanism can effectively reduce the surface tension of the liquid through suction, making it easier for the droplets remaining at the bottom of the wafer W to evaporate or be carried away by the airflow. In addition, this mechanism can also reduce drying spots, watermarks, or contaminant accumulation caused by liquid residue, further improving the cleanliness and drying uniformity of the wafer surface. This negative pressure drying technology can be used alone or in combination with other airflow guiding mechanisms (such as the downward airflow provided by the jet device 600) to achieve a more efficient wafer drying effect and ensure the stability and high yield of subsequent processes.

[0026] Please refer to Figure 5, which shows a second operational view of the drying platform according to an embodiment of this application. In some embodiments, an external air source provides a positive-pressure drying gas to enhance the airflow blowing effect and accelerate liquid removal from the bottom of the wafer. When the drying process is started, the positive-pressure drying gas generated by the external air source is introduced into the elongated groove 402 through the gas channel 403 and uniformly released from the surface of the elongated rod 401 to the bottom of the wafer. Through the blowing action of the high-pressure airflow, the surface tension of the liquid can be effectively broken, causing the droplets remaining at the bottom of the wafer to move quickly and detach from the surface. In addition, the airflow can further promote the evaporation of the liquid, reduce the risk of water stains, and ensure the cleanliness of the wafer surface and the uniformity of drying. In some applications, the positive-pressure drying gas can work in conjunction with the downward airflow generated by the jet device 600 to make the airflow direction consistent with the liquid discharge direction, further improving the drying efficiency. In addition, this drying technology can adjust the gas pressure and flow rate according to different process requirements to adapt to different types of wafer sizes and wet process conditions, improving the applicability and flexibility of the drying device.

[0027] This application also provides an operation method for a wafer drying apparatus, wherein the structure of the wafer drying apparatus is as described above and will not be repeated here. It should be understood that the wafer drying apparatus 10 may further include a host in addition to the above-described structure. The host is communicatively connected to each component of the wafer drying apparatus 10 and includes an electrically connected processor and a memory. The processor and memory of the host are mounted on a circuit board. The memory is configured to store executable program code. The processor reads the executable program code stored in the memory and runs the program corresponding to these executable program codes to execute the operation method of the wafer drying apparatus of this application.

[0028] In this embodiment, the processor is typically configured to control the overall operation of the host. The processor may include one or more processors to execute instructions that perform actions in all or part of the steps of the operation of the wafer drying apparatus 10 described above. Furthermore, the processor may include one or more modules that facilitate interaction between the processor and other components. For example, the processor may include a communication module to facilitate interaction between communication components and the processor. The storage is configured to store various types of data to support the operation of the host. Examples of such data include instructions for any application or method operating on the host. The storage may be implemented using any type of volatile or non-volatile storage device or a combination thereof. Power supply circuitry supplies power to various components of the host. The power supply circuitry may include a power management system, one or more power supplies, and any other components associated with the generation, management, and distribution of power to the host. In an exemplary embodiment, the host may be implemented by a separate terminal device or by electronic components such as a controller or microcontroller integrated into the wafer drying apparatus 10.

[0029] Please refer to Figure 6, which shows a flowchart of the operation method of the wafer drying apparatus according to an embodiment of this application. The operation method of the wafer drying apparatus of this application includes: First, in step S61, the wafer drying apparatus 10 as described above is provided. As shown in Figure 1, the wafer drying apparatus 10 includes a tank 100, a fixing frame 200, a placement platform 300, a drying platform 400, a wafer boat 500, a plurality of jet devices 600, and an external air source. The structures of these and other additional components are as described above and will not be repeated here.

[0030] As shown in Figure 1, in step S62, the wafer boat 500 carrying the wafers W is moved into the tank 100 through the opening 103 and placed on the placement platform 300, wherein the bottom ends of the wafers W abut against the drying platform 400. Specifically, in some embodiments, the wafer boat 500 is moved into the tank 100 through a moving mechanism and placed securely on the placement platform 300. At this time, the bottom end of each wafer W abuts against the drying platform 400, making it fully contacted with the drying mechanism to facilitate subsequent drying processing. In some embodiments, the drying platform 400 can moderately raise the bottom end of the wafer W to ensure that the airflow can act evenly on the bottom area and avoid the shading effect that the wafer boat 500 may produce. In addition, the placement position of the wafer boat 500 can be adjusted according to different wafer sizes and batch requirements to ensure the best drying effect and further improve process yield and wafer surface quality.

[0031] In step S63, liquid is injected into the tank 100 to immerse the wafers W therein. Optionally, the liquid is deionized water (DI water) used to clean the wafer surface to remove residual contaminants, particles, or chemical reagents, ensuring the effectiveness of the subsequent drying process. In this embodiment, after the liquid is injected into the tank 100, the wafer boat 500, along with the wafers W it carries, will be completely submerged in the liquid, allowing the liquid to uniformly cover the wafer surface, thereby improving the cleaning effect. In some applications, ultrasonic or bubble agitation mechanisms can be used to improve the efficiency of removing particles and chemical residues. In addition, the liquid flow rate, temperature, and cleaning time can be adjusted according to different process requirements to ensure the best cleaning effect, thereby improving the stability and reliability of the wafer manufacturing process.

[0032] In step S64, the liquid is drained. Specifically, a drain outlet is provided on the bottom wall 101 of the tank 100. The liquid is gradually drained through the drain outlet at the bottom of the tank 100, achieving a controlled drainage process. Typically, the liquid drainage process requires precise control of the flow rate to prevent the liquid level from dropping rapidly, thereby avoiding water stains due to uneven water distribution or surface tension effects. To further optimize the drainage effect, a staged drainage strategy can be adopted, that is, draining most of the liquid at a faster rate initially, and then slowing down the drainage rate to allow the liquid to gradually and evenly withdraw from the wafer surface, reducing the risk of residual water droplets adhering.

[0033] In some embodiments, while discharging the liquid, an inert gas (such as nitrogen) can be introduced simultaneously for airflow assistance to accelerate liquid evaporation and ensure that the wafer surface remains uniformly dry during the drainage process, further improving the drying effect and process stability. Specifically, the jet device 600 located above the tank 100 can be activated to blow hot nitrogen gas at a controlled temperature onto the wafer surface from the left and right sides above the wafer through its gas outlet. This airflow can effectively reduce the influence of surface tension, promote liquid film rupture and moisture evaporation, and prevent liquid from re-accumulating on the wafer surface, avoiding the formation of water stains or drying marks. In addition, by adjusting the jet angle and flow rate of the jet device 600, the airflow distribution can be further optimized so that the hot nitrogen gas uniformly covers the wafer surface, ensuring that each wafer can achieve the ideal initial drying effect, laying the foundation for subsequent more refined drying steps. To further improve drying uniformity, the airflow guiding mechanism and blowing flow rate can be dynamically adjusted according to the wafer size and arrangement density, so that hot nitrogen can penetrate deep into the wafer gaps, effectively eliminating possible drying dead zones, ensuring that the entire batch of wafers can achieve the best drying effect, and improving process stability and product yield.

[0034] In step S65, the liquid adhering to the bottom of the wafer is removed by drying gas supplied by an external gas source. Specifically, the drying platform 400, located below the tank 100, is activated, allowing it to uniformly release hot nitrogen gas at a controlled temperature through the internally configured gas channels 403 and elongated grooves 402. This hot nitrogen gas flows parallel to the bottom of the wafer, forming a stable and uniform airflow layer, which effectively reduces the influence of surface tension, promotes the breakup and evaporation of water droplets, and thus accelerates the drying process. In addition, by adjusting the gas flow rate and temperature of the drying platform 400, sufficient airflow coverage can be ensured for the bottom of the wafer, avoiding uneven drying in certain areas, and further improving drying efficiency and process stability. In some embodiments, the drying platform 400 can also be designed to appropriately lift the wafer, so that its bottom is completely exposed to the airflow environment, reducing the impact of the structure of the wafer boat 500 on the airflow distribution and further optimizing the drying effect.

[0035] As shown in Figure 4, in some embodiments, an external air source provides a drying gas with negative pressure to optimize the liquid removal efficiency at the bottom of wafer W. When the drying process is started, the negative pressure environment generated by the external air source can form a local low-pressure zone near the drying platform 400. Through airflow drive and pressure difference, the liquid adhering to the bottom of wafer W is quickly removed from the surface. Specifically, the negative pressure drying mechanism can effectively reduce the surface tension of the liquid through suction, making it easier for the droplets remaining at the bottom of wafer W to evaporate or be carried away by the airflow. In addition, this mechanism can also reduce drying spots, watermarks, or contaminant accumulation caused by liquid residue, further improving the cleanliness and drying uniformity of the wafer surface. This negative pressure drying technology can be used alone or in combination with other airflow guiding mechanisms (such as the downward airflow provided by the jet device 600) to achieve a more efficient wafer drying effect and ensure the stability and high yield of subsequent processes.

[0036] As shown in Figure 5, in some embodiments, an external air source provides positive-pressure drying gas to enhance the airflow blowing effect and accelerate liquid removal from the bottom of the wafer. When the drying process starts, the positive-pressure drying gas generated by the external air source is introduced into the elongated groove 402 through the gas channel 403 and uniformly released from the surface of the elongated rod 401 to the bottom of the wafer. Through the blowing action of the high-pressure airflow, the surface tension of the liquid can be effectively broken, causing the droplets remaining on the bottom of the wafer to move quickly and detach from the surface. In addition, the airflow can further promote the evaporation of the liquid, reduce the risk of water stains, and ensure the cleanliness and uniformity of the wafer surface. In some applications, the positive-pressure drying gas can work in conjunction with the downward airflow generated by the jet device 600 to make the airflow direction consistent with the liquid discharge direction, further improving the drying efficiency. In addition, this drying technology can adjust the gas pressure and flow rate according to different process requirements to adapt to different wafer sizes and wet process conditions, improving the applicability and flexibility of the drying device.

[0037] In summary, this application proposes a wafer drying apparatus and its operating method, which achieves comprehensive drying of the bottom of the wafer by introducing a drying platform. Specifically, the drying platform can slightly elevate the wafer, exposing the bottom of the wafer to the airflow environment, thereby promoting the evaporation and removal of moisture. The main airflow guiding system, composed of jet devices, precisely controls the distribution and flow rate of the drying gas through directional airflow, ensuring that every area of ​​the wafer is uniformly heated and moisture is removed.

[0038] The wafer drying apparatus and its operation method provided in the embodiments of this application have been described in detail above. Specific embodiments have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application. [Simplified Explanation of the Diagram]

[0039] The following detailed description of the specific embodiments of this application, in conjunction with the accompanying drawings, will make the technical solution and other beneficial effects of this application readily apparent.

[0040] Figure 1 shows a schematic diagram of a wafer drying apparatus according to an embodiment of this application.

[0041] Figure 2 shows a perspective view of the wafer drying apparatus in Figure 1.

[0042] Figure 3 shows a partial schematic diagram of the tank in an embodiment of this application.

[0043] Figure 4 shows a first operational view of the drying platform according to an embodiment of this application.

[0044] Figure 5 shows a second operational view of the drying platform according to an embodiment of this application.

[0045] Figure 6 shows a flowchart of the operation method of the wafer drying apparatus according to an embodiment of this application.

Claims

1. A wafer drying apparatus, comprising: A tank has a bottom wall, a plurality of side walls and an opening, wherein the side walls surround the bottom wall and the opening is located above the tank. A placement platform and a drying platform are located near the bottom wall; an external gas source is connected to the drying platform to provide a drying gas; And a crystal boat for carrying a plurality of wafers, wherein the crystal boat enters the tank through the opening and is placed on the placement platform, and the bottom ends of the wafers abut against the drying platform so that the liquid adhering to the bottom ends of the wafers is removed by the drying gas provided by the external gas source.

2. The wafer drying apparatus of claim 1, wherein the drying platform comprises: A long rod extends along the arrangement direction of the wafers; An elongated groove is formed on the surface where the elongated rod contacts the wafers; And a gas channel communicating with the elongated groove and connected to the external gas source, wherein the dry gas provided by the external gas source is introduced into the elongated groove through the gas channel and applied to the bottom of the wafers to remove the liquid.

3. The wafer drying apparatus of claim 1, wherein the external gas source provides the drying gas with negative pressure.

4. The wafer drying apparatus of claim 1, wherein the external gas source provides the drying gas having positive pressure.

5. The wafer drying apparatus of claim 1, wherein the wafer drying apparatus further comprises a plurality of jet devices disposed on the sidewalls, and the outlets of the jet devices are directed toward the wafers.

6. A method for operating a wafer drying apparatus, comprising: Provide a wafer drying apparatus as described in claim 1; move the wafer boat carrying the wafers through the opening into the tank and place it on the placement platform, wherein the bottom ends of the wafers abut against the drying platform; inject the liquid into the tank to immerse the wafers therein; drain the liquid; remove the liquid adhering to the bottom ends of the wafers by means of a drying gas provided by an external gas source.

7. A method of operating the wafer drying apparatus as claimed in claim 6, wherein the drying platform comprises: A long rod extends along the arrangement direction of the wafers; An elongated groove is formed on the surface where the elongated rod contacts the wafers; The method includes a gas channel communicating with the elongated groove and connected to an external gas source, wherein the dry gas provided by the external gas source removes liquid adhering to the bottom of the wafers.

8. A method of operating the wafer drying apparatus of claim 6, wherein the external gas source provides the drying gas having a negative pressure, and the drying gas provided by the external gas source removes liquid adhering to the bottom of the wafers, the method comprising: The liquid at the bottom of the wafers is removed by vacuuming.

9. A method of operating the wafer drying apparatus of claim 6, wherein the external gas source provides the drying gas having a positive pressure, and the drying gas provided by the external gas source removes liquid adhering to the bottom of the wafers, the method comprising: The liquid at the bottom of the wafers is removed by airflow.

10. A method of operating the wafer drying apparatus of claim 6, wherein the wafer drying apparatus further comprises a plurality of jetting devices disposed on the sidewalls, and the outlets of the jetting devices are directed toward the wafers, and after discharging the liquid, the method of operating further comprises: These jet devices blow air toward the surface of the wafers and generate a downward airflow.

Images