Separation device

Abstract

The present invention aims to provide a separation device that enables fluid to be accurately sprayed onto the bonding interface of a bonded wafer. The separation device comprises: a wafer holding section that holds a bonded wafer having a first wafer and a second wafer bonded to the first wafer, and rotates the bonded wafer about a first rotation axis extending in a first direction as a rotation center; a nozzle that sprays fluid onto the side of the bonded wafer; a position detection device that detects the position of the bonding interface of the first wafer and the second wafer in the first direction, and the position of the fluid spray from the nozzle in the first direction; a nozzle rotating stage that rotates the nozzle about a second rotation axis parallel to the first rotation axis as a rotation center; and a single-axis stage that moves the nozzle along the first direction; and controls the single-axis stage to move the nozzle along the first direction based on the position of the bonding interface in the first direction and the position of the fluid spray in the first direction detected by the position detection device.

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