Semiconductor apparatus, method for fabricating semiconductor device, and semiconductor device
TW202641247APending Publication Date: 2026-10-01ASM IP HLDG BV
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Patent Information
- Application Number
- TW114146967
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-05
- Filing Date
- 2025-12-02
- Publication Date
- 2026-10-01
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Abstract
The disclosure relates to semiconductor processing, specifically an apparatus and methods for partially fabricating a semiconductor device using a cyclical deposition-etch process. The apparatus includes at least one reactor with a reaction chamber, a metal precursor source for delivering metal precursor vapor, and an etchant source for delivering etchant vapor. A vapor distribution and removal system supplies these vapors to the reaction chamber and removes them afterward. A sequence controller, connected to the distribution and removal system, includes a memory with a program that controls vapor flow from the metal precursor source during one or more deposition cycles.
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