Upper components, substrate processing equipment and top plate assembly
TW202641249APending Publication Date: 2026-10-01TOKYO ELECTRON LTD
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Patent Information
- Application Number
- TW115100846
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-20
- Filing Date
- 2026-01-09
- Publication Date
- 2026-10-01
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Figure 00000000_0000_ABST
Abstract
The upper component disclosed in this invention comprises: a top plate having an upper surface and configured to extend over a processing space within a cavity of a substrate processing apparatus; a base member disposed on the top plate; at least one actuator configured to lift the top plate to apply force to the base member, and including a rod having a lower end and a drive portion configured to move the rod up and down; and at least one coupling member assembled to the top plate and including an upper portion protruding from the upper surface of the top plate, one of the lower end and the upper portion having a groove, and the other of the lower end and the upper portion having a protrusion that can be plugged into the groove in a horizontal direction.
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