Upper components, substrate processing equipment and top plate assembly

TW202641249APending Publication Date: 2026-10-01TOKYO ELECTRON LTD
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Patent Information

Application Number
TW115100846
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-20
Filing Date
2026-01-09
Publication Date
2026-10-01

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Abstract

The upper component disclosed in this invention comprises: a top plate having an upper surface and configured to extend over a processing space within a cavity of a substrate processing apparatus; a base member disposed on the top plate; at least one actuator configured to lift the top plate to apply force to the base member, and including a rod having a lower end and a drive portion configured to move the rod up and down; and at least one coupling member assembled to the top plate and including an upper portion protruding from the upper surface of the top plate, one of the lower end and the upper portion having a groove, and the other of the lower end and the upper portion having a protrusion that can be plugged into the groove in a horizontal direction.
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