Work handling machine operator

TW202641269APending Publication Date: 2026-10-01DAIHEN CORP
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Patent Information

Application Number
TW115109398
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-24
Filing Date
2026-03-13
Publication Date
2026-10-01

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Abstract

[Problem] To provide a workpiece handling robot that can hold thin plate-shaped workpieces even when there is no airflow path inside the vacuum suction pump or robot. [Solution] The workpiece handling robot A1 includes a support body 1 supporting the workpiece W and a deformable pad 2 disposed on the support body 1. The deformable pad 2 has a base portion 21 and an annular pad portion 22 connected to the outer periphery of the base portion 21 and extending upward and capable of elastic deformation. The support body 1 has a first upper surface 1a and a first recess 13 recessed from the first upper surface 1a for mounting the base portion 21. The support body 1 does not have an airflow path communicating with the first recess 13.
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