Alignment device and method of using the same

Abstract

The present invention discloses an alignment device and the method using the same for aligning multiple components onto a wafer including multiple dies, including: a laser source; a beam expander; and a liquid crystal panel having a plurality of liquid crystal switch units, and each the die corresponds to at least one of the liquid crystal switch units, and a light beam passes through the liquid crystal switch unit to irradiate at a predetermined position, thereby the component can be aligned and mounted onto the predetermined position. By the implementation of the present disclosure, the light beam from the laser source can be expanded by the beam expander, then to be allowed to irradiate to a plurality of predetermined positions by the liquid crystal switch units for aligning and mounting the multiple components simultaneously, thereby to increase the efficiency of the alignment device, and to improve the production capacity effectively.

Description

[Technical Field]

[0001] The present invention relates to an alignment device, and more particularly to an alignment device for simultaneously aligning multiple elements onto a wafer containing a plurality of grains. [Previous Technology]

[0002] With the booming development of portable electronic products in recent years, the development of various related products is also trending towards high density, high performance, and lightweight, thin, short, and small designs. At the same time, semiconductor devices are gradually moving towards heterogeneous integration, leading to the rise of 3D multi-chip packaging technology. To improve the signal transmission speed between the increasing number of chips and components within semiconductor devices, as well as between semiconductor devices and external circuits or components, optical communication technology has been introduced, using optical fibers as the signal propagation medium in critical signal paths. Among related technologies, Co-Packaged Optics (CPO) technology has become a key technology that the industry has been vigorously developing in recent years.

[0003] In existing manufacturing processes, when a fiber optic connector is to be attached to a semiconductor device such as an optical engine (OE) chip or wafer, the operator usually first manually points a laser beam at the predetermined installation position of the fiber optic connector on a single chip, and then aligns and fixes the fiber optic connector to the predetermined installation position illuminated by the beam by means of adhesive dispensing or other methods.

[0004] However, since this alignment method can only align a single die or a single mounting position on a single wafer at a time, the alignment device and alignment operation are extremely inefficient and severely limit the capacity of the entire production line.

[0005] Therefore, how to overcome the various problems of the aforementioned conventional technologies has become a pressing issue that the industry urgently needs to address. [Summary of the Invention]

[0006] In view of the various deficiencies of the prior art, the present invention provides an alignment device for aligning a plurality of elements onto a wafer containing a plurality of uncut dies. The alignment device includes: a laser light source; a beam expander disposed between the laser light source and the wafer to receive a light beam emitted by the laser light source and expand its range before emitting it toward the wafer; and a liquid crystal panel disposed between the beam expander and the wafer and having a plurality of liquid crystal switching units, wherein each die on the wafer corresponds to at least one liquid crystal switching unit, and by turning on the liquid crystal switching unit, a light beam irradiated from the beam expander toward a predetermined setting position of the corresponding die passes through, so that an element is aligned and set at the predetermined setting position.

[0007] The present invention further provides a method for applying an alignment device, the method comprising: providing a wafer comprising a plurality of uncut dies; orienting an alignment device as described above toward the wafer so that a light beam passing through the activated liquid crystal switching unit passes through a predetermined setting position for setting the element; and setting the element at the predetermined setting position reached by the light beam passing through the liquid crystal switching unit.

[0008] In the aforementioned alignment device and its application method, the alignment device further includes a control circuit, which is signal-connected to the liquid crystal panel, and controls the liquid crystal switching unit to open so as to allow the beam of light from the beam expander to pass through the predetermined setting position.

[0009] In the aforementioned alignment device and its application method, the alignment device further includes a control circuit, which is connected to the liquid crystal panel via a signal, and controls the liquid crystal switch unit to close to block the light beam that is not directed toward the predetermined setting position from passing through.

[0010] In the aforementioned alignment device and its application method, the wafer has a plurality of predetermined positions for the plurality of elements to be arranged one-to-one.

[0011] In the aforementioned alignment device and its application method, the plurality of elements are first disposed on a carrier, and after alignment is completed by the alignment device, they are then attached to the wafer by the carrier.

[0012] The aforementioned method of applying the alignment device further includes: performing a dispensing step, which involves dispensing the adhesive at the predetermined setting position reached by the light beam passing through the liquid crystal switching unit; causing the element to adhere to the predetermined setting position by means of the adhesive; curing the adhesive; and cutting the die so that each of the crystals on which the element is disposed is separated from each other.

[0013] In the aforementioned method of applying the alignment device, the wafer has a plurality of predetermined positions for the plurality of components to be arranged one by one, and the plurality of components are first disposed on a carrier, and then the carrier is used to adhere the plurality of components to the predetermined positions by means of the adhesive after the dispensing step is completed.

[0014] In the aforementioned method of applying the alignment device, the carrier system is composed of a material that is cured by ultraviolet light, the adhesive system is a thermosetting material, and after the plurality of elements are attached to the predetermined setting position by means of the adhesive using the carrier, the carrier is first cured by ultraviolet light, then the carrier is removed, and then the adhesive is thermoset.

[0015] As can be seen from the above, the present invention expands the beam emitted by the laser light source by a beam expander, and then controls the beam to be directed to multiple predetermined positions on the wafer by multiple liquid crystal switching units of the liquid crystal panel, so that multiple elements can be aligned at the same time, thereby improving the working efficiency of the alignment device and effectively increasing the production capacity. [Simplified Explanation of the Diagram]

[0040] Figure 1A is a schematic diagram of an embodiment of the alignment device of the present invention;

[0041] Figure 1B is a top view schematic diagram of a wafer according to an embodiment of the alignment device of the present invention;

[0042] Figure 1C is a top view schematic diagram of the liquid crystal panel of an embodiment of the alignment device of the present invention;

[0043] Figures 2A to 2H are schematic diagrams of an embodiment of the application method of the alignment device of the present invention;

[0044] Figures 3A and 3B are schematic diagrams of another embodiment of the application method of the alignment device of the present invention.

Implementation Method

[0016] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0017] It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings of this specification are only used to complement the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention. At the same time, the terms such as "above," "below," "one," "first," and "second" used in this specification are only for clarity of description and are not intended to limit the scope of the present invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the present invention.

[0018] Figure 1A is a schematic diagram of an embodiment of the alignment device of the present invention; Figure 1B is a top view schematic diagram of a wafer of an embodiment of the alignment device of the present invention; Figure 1C is a top view schematic diagram of a liquid crystal panel of an embodiment of the alignment device of the present invention; Figures 2A to 2H are schematic diagrams of an embodiment of an application method of the alignment device of the present invention; Figures 3A and 3B are schematic diagrams of another embodiment of an application method of the alignment device of the present invention.

[0019] As shown in Figures 1A to 1C, this embodiment provides an alignment device 1 for aligning a plurality of elements C (see also Figures 2D to 2H) onto a wafer W containing a plurality of uncut dies D. Each die D is, for example, an optical engine die (OE die), and each element C may be a fiber optic connector, but is not limited to those exemplified herein.

[0020] As shown in Figure 1A, the alignment device 1 includes: a laser light source 10, a beam expander 20, and a liquid crystal panel 30.

[0021] The laser source 10 is used to provide a laser beam (beam) b1. The laser beam b1 is emitted toward the beam expander 20 and the wafer W. Generally, the laser source 10 used in this embodiment provides a laser beam b1 in the visible light band, but a laser beam b1 in the non-visible light band such as ultraviolet (UV) can also be used. This embodiment does not have any particular limitation on this.

[0022] The beam expander 20 is disposed between the laser light source 10 and the wafer W to receive the laser beam b1 emitted by the laser light source 10, then expand its range (diameter), and then shoot the expanded beam b2 toward the wafer W so that the predetermined irradiation range of the expanded beam b2 can cover the plurality of grains D on the wafer W as shown in FIG. 1B. Preferably, the diameter of the expanded beam b2 formed after the beam is expanded by the beam expander 20 is greater than or equal to the diameter of the wafer W, so that all grains D on the wafer W can be within the coverage of the expanded beam b2, but this embodiment does not impose any limitation on this.

[0023] A liquid crystal panel 30 is disposed between the beam expander 20 and the wafer W and has a plurality of liquid crystal switching units 31. The plurality of liquid crystal switching units 31 can be controlled by electrical signals to switch on and off respectively. When a liquid crystal switching unit 31 is turned on, light is allowed to pass through the liquid crystal switching unit 31, and when it is turned off, light is blocked from passing through. Generally, each die D in the wafer W corresponds to at least one liquid crystal switching unit 31, and by turning on the liquid crystal switching unit 31, the portion of the expanded beam b2 from the beam expander 20 corresponding to the turned-on liquid crystal switching unit 31 passes through, forming a alignment beam (beam) b3 with the same cross-section as the shape of the liquid crystal switching unit 31. The alignment beam b3 then irradiates a predetermined position P on the corresponding die D. That is, the position illuminated by the alignment beam b3 is the predetermined setting position P of the component C. In this way, whether it is a manual operator or an automated operation equipment, multiple components C can be correctly installed and set in their respective predetermined setting positions P according to the position illuminated by the alignment beam b3.

[0024] In a preferred embodiment, the alignment device 1 further includes a control circuit 40. The control circuit 40 is signal-connected to the liquid crystal panel 30 to control the opening of each liquid crystal switch unit 31 on the liquid crystal panel 30, allowing the portion of the expanded beam b2 from the beam expander 20 that is irradiated toward the predetermined setting position P to pass through the liquid crystal switch unit 31 and become the aforementioned alignment beam b3.

[0025] In some variations of the embodiment, the control circuit 40 can not only control the opening of each liquid crystal switch unit 31, but also control other liquid crystal switch units 31' to close them, thereby blocking the passage of light beams not directed toward the predetermined setting position P. With this design, the liquid crystal panel 30 can become a universal type that can accommodate wafers W with various different designs of the die D. Before use, the manufacturer only needs to select the corresponding liquid crystal switch unit for the predetermined setting position P on different dies D, such as the liquid crystal switch unit 31 in this embodiment, and set the control circuit 40 to open it. As for those liquid crystal switch units that do not correspond to the predetermined setting position P on the die D, such as the liquid crystal switch unit 31' in this embodiment, the control circuit 40 can be set to remain closed. Thus, the liquid crystal panel 30 can be adapted to and applied to wafers W with dies D having various different predetermined setting positions P of the element C.

[0026] Furthermore, since a wafer W typically contains multiple dies D that require the mounting of the component C, such as optical engine dies D that require the mounting of fiber optic connectors, the wafer W generally has multiple predetermined mounting positions P for the plurality of components C to be mounted one-to-one. In some more advanced manufacturing processes, some optical engine dies D even require the mounting of multiple fiber optic connectors on each one, and this embodiment does not impose any particular limitations on this.

[0027] In addition, in order to further improve process efficiency, the plurality of components C to be installed can be first placed on the bottom surface of the carrier Cr (please refer to Figures 2D and 2E at the same time), and the alignment device 1 can be used to align all components C on the bottom surface of the carrier Cr at the same time. After the alignment is completed, the plurality of components C can be placed on the wafer W by the carrier Cr at the same time.

[0028] Please refer to Figures 2A to 2H in conjunction with this embodiment. This embodiment also provides an application method of the alignment device 1, which includes: providing a wafer W containing a plurality of uncut dies D; orienting the alignment device 1 toward the wafer W so that a light beam passing through the activated liquid crystal switch unit 31 passes through a predetermined setting position P for setting the element C; and setting the element C at the predetermined setting position P reached by the light beam passing through the liquid crystal switch unit 31.

[0029] In detail, in the application method provided in this embodiment, as shown in FIG2A, the first step is to provide a wafer W, on which a plurality of grains D have been arranged or formed but have not yet been cut, and as mentioned above, each of the grains D has a predetermined placement position P for mounting an element C.

[0030] Next, as shown in FIG2B, the alignment device 1 is oriented toward the wafer W, that is, each alignment beam b3 after the liquid crystal switch unit 31 that has been turned on passes through and illuminates a predetermined setting position P of a die D on the wafer W for setting the element C.

[0031] Referring also to FIG1A, in a preferred embodiment, the alignment device 1 further includes a control circuit 40 connected to the liquid crystal panel 30, and the control circuit 40 controls the individual liquid crystal switching units 31 to open, so as to allow the alignment beams directed toward each predetermined setting position P to pass through. As for the liquid crystal switching units 31' corresponding to beams not directed toward the predetermined setting position P, they can be controlled by the control circuit 40 to close to block the beams from passing through.

[0032] As shown in FIG2C, the next step is to perform a dispensing step. In this step, the dispensing device 50 applies an adhesive G, for example a thermosetting material, to each predetermined setting position P reached by the plurality of alignment beams of each of the activated liquid crystal switch units 31, so as to subsequently attach the component C to be installed.

[0033] Since the wafer W has multiple dies D, and each die D has at least one predetermined mounting position P for mounting components C, that is, the wafer W has multiple predetermined mounting positions P that correspond one-to-one with multiple components C for mounting the multiple components C, in order to improve the efficiency of the mounting work, the multiple components C can be first mounted on the bottom surface of a carrier Cr. As shown in Figure 2D, the carrier Cr is, for example, made of a transparent material cured by ultraviolet light, and the carrier Cr can be made into the same shape and size as the wafer W, including having the same flat edges, notches or other types of alignment marks (not shown) as the wafer W for alignment, so that operators or automated equipment can first align the carrier Cr with the wafer W. Then the carrier Cr together with the components C on its bottom surface is placed on the surface of the wafer W, and the components C are adhered to their corresponding predetermined mounting positions P by the adhesive G previously mounted on the wafer W (please also refer to Figure 1B). In some variations of the embodiment, a release film or tape (not shown) may be attached to each element C to protect the element C, and the element C may be attached to the bottom surface of the carrier Cr by the release film or tape, but this embodiment does not impose any restrictions on this.

[0034] Next, as shown in Figure 2E, the carrier Cr is irradiated with ultraviolet light (UV) to cure it. After this UV curing step is completed, the carrier Cr is removed as shown in Figure 2F, leaving only the components C attached to the surface of the wafer W with their corresponding colloids (G). If the components C are in the form of a release film or tape as described above, the release film or tape can be removed together with the carrier Cr after the carrier Cr has cured.

[0035] Then, as shown in Figure 2G, heat H is applied to the surface of the wafer W to cure the colloid G made of thermosetting material. After the colloid G has also cured, each component C is correctly and firmly set at the predetermined setting position P of each die D of the wafer W.

[0036] As shown in Figure 2H, the next step is to perform a dicing operation, in which the complex number of chips D with the components C correctly installed are cut off from the wafer W and separated from each other, so as to obtain the complex number of chips D with the components C correctly installed.

[0037] As shown in Figure 3A, in a modified embodiment, after completing the dispensing step (see Figure 2C), multiple discrete components C can be directly aligned to the colloid G on the wafer W, instead of first setting the plurality of components C on the carrier Cr as shown in Figure 2D. Then, the colloid G is used to directly adhere each component C to its corresponding predetermined setting position P (see also Figure 1B), and the colloid G is then heated to cure it. The difference from the previous embodiment is that the carrier Cr is omitted in this embodiment. Finally, as shown in Figure 3B, the die is cut, thus obtaining a plurality of correctly positioned components C on the die D.

[0038] In summary, the present invention expands the beam emitted by a laser light source using a beam expander, and then controls multiple correct beams to pass simultaneously through multiple liquid crystal switching units of a liquid crystal panel so that they irradiate various predetermined positions on the wafer, thereby enabling multiple elements to be aligned simultaneously. This significantly improves the working efficiency of the alignment device and effectively increases production capacity.

[0039] The above embodiments are used to illustrate the principles and effects of the present invention, and are not intended to limit the present invention. Any person skilled in the art can make modifications to the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as set forth in the appended claims.

Claims

1. An alignment device for aligning a plurality of elements onto a wafer containing a plurality of uncut dies, the alignment device comprising: Laser light source; A beam expander is disposed between the laser source and the wafer to receive the beam emitted by the laser source and expand its range before shooting it toward the wafer; as well as A liquid crystal panel is disposed between the beam expander and the wafer and has a plurality of liquid crystal switching units. Each of the chips corresponds to at least one of the liquid crystal switching units. By turning on the liquid crystal switching unit, a light beam irradiated from the beam expander to a predetermined setting position of the corresponding chip passes through, so that an element is aligned and set at the predetermined setting position.

2. The alignment device as described in claim 1, wherein, The alignment device further includes a control circuit that is signal-connected to the liquid crystal panel and controls the liquid crystal switching unit to open so as to allow the beam of light from the beam expander to pass through the predetermined setting position.

3. The alignment device as described in claim 1, wherein, The alignment device further includes a control circuit that is connected to the liquid crystal panel via a signal. The control circuit controls the liquid crystal switch unit to turn off in order to block the light beam that is not directed toward the predetermined setting position from passing through.

4. The alignment device as described in claim 1, wherein, The wafer has a plurality of predetermined positions for the plurality of components to be installed one-to-one.

5. The alignment device as described in claim 1, wherein, The complex components are first placed on a carrier, and then the carrier is attached to the wafer.

6. A method for using an alignment device, the method comprising: Provide a wafer containing a plurality of uncut dies; Orient the alignment device as described in claim 1 toward the wafer so that a light beam passing through the activated liquid crystal switching unit leads to a predetermined mounting position for setting the element; and The element is disposed at the predetermined location reached by the light beam passing through the liquid crystal switching unit.

7. The method of using the alignment device as described in claim 6, wherein, The alignment device further includes a control circuit that is signal-connected to the liquid crystal panel and controls the liquid crystal switching unit to open so as to allow the beam of light from the beam expander to pass through the predetermined setting position.

8. The method of using the alignment device as described in claim 6, wherein, The alignment device further includes a control circuit that is connected to the liquid crystal panel via a signal. The control circuit controls the liquid crystal switch unit to turn off in order to block the light beam that is not directed toward the predetermined setting position from passing through.

9. A method of using the alignment device as described in claim 6, wherein, The wafer has a plurality of predetermined positions for the plurality of components to be installed one-to-one.

10. A method of using the alignment device as described in claim 6, wherein, The complex components are first placed on a carrier, and then the carrier is attached to the wafer.

11. The method of using the alignment device as described in claim 6 further includes: The dispensing step involves placing the adhesive at the predetermined location reached by the light beam passing through the liquid crystal switching unit. The component is adhered to the predetermined location by the adhesive. The colloid was cured; and The individual crystals containing the element are cut to separate each other.

12. The method of using the alignment device as described in claim 11, wherein, The wafer has a plurality of predetermined positions for a plurality of components to be disposed in a corresponding manner, and the plurality of components are first disposed on a carrier, and then the carrier is used to attach the plurality of components to the predetermined positions by means of an adhesive.

13. The method of using the alignment device as described in claim 12, wherein, The carrier system is composed of a material that is cured by ultraviolet light. The adhesive system is a thermosetting material. After the multiple components are attached to the predetermined position by the adhesive using the carrier, the carrier is first cured by ultraviolet light, then the carrier is removed, and then the adhesive is thermoset.

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