Multifunctional grain production carrier

Abstract

A multifunctional grain production carrier is provided. The multifunctional grain production carrier includes a main body, a first direction adjusting device, a second direction adjusting device, and a cover. The main body includes a base component, a first direction reference component, and a second direction reference component. The base component is used to hold the grains. The first direction adjusting device is movably installed on the base component and includes a first spring plate. The first spring plate moves in a first direction to press the grains against the first direction reference component. The second direction adjusting device is movably installed on the base component and includes a second spring plate. The second spring plate moves in the second direction to press the grains against the second direction reference component. The cover is installed on the main body, and the first direction adjusting device and second direction adjusting device are positioned between the main body and the cover.

Description

Technical Field

[0001] This disclosure relates to a carrier, and more particularly to a multifunctional grain production carrier. Prior Technology

[0002] Die manufacturing carriers (wafer carriers) are specialized tools used in semiconductor manufacturing to hold, protect, and transport dies / chips. These carriers play a crucial role in all stages of the die manufacturing process, from wafer dicing to packaging.

[0003] As semiconductor technology continues to advance and die size continues to shrink, the wafer carriers that support the die will inevitably need to adjust their structural requirements to accommodate the die size. For example, there is a need for carriers with more precise positioning to meet production needs and to accurately position the products.

[0004] Furthermore, conventional technologies utilize different carriers for different processes, which may damage the die during the transport or transfer of the die, leading to a decrease in process yield. Summary of the Invention

[0005] This disclosure provides a multifunctional die production carrier that, in addition to being versatile, also has the ability to position the die. Its use in the production process can significantly improve efficiency, eliminate the need to change carriers between different processes, and reduce processing time and the risk of component damage.

[0006] This disclosure discloses an embodiment of a multifunctional die production carrier suitable for at least one die. The multifunctional die production carrier includes a body, a first orientation adjustment device, a second orientation adjustment device, and a cover. The body includes a base element, at least one first orientation reference element, and at least one second orientation reference element. The at least one first orientation reference element is disposed along a first direction and protrudes from the base element, and the at least one second orientation reference element is disposed along a second direction and protrudes from the base element. The first direction is perpendicular to the second direction. The base element is used to hold at least one die. The first orientation adjustment device is movably disposed on the base element and includes at least one first spring. The at least one first spring moves along the first direction to support at least one die against at least one first orientation reference element. The second orientation adjustment device is movably disposed on the base element and includes at least one second spring. The at least one second spring moves along the second direction to support at least one die against at least one second orientation reference element. The cover is disposed on the body, and the first orientation adjustment device and the second orientation adjustment device are located between the body and the cover.

[0007] In one embodiment, the at least one first spring and the at least one second spring each have a bending structure.

[0008] In one embodiment, the cover includes a plurality of grooves to expose at least one first spring and at least one second spring in a portion.

[0009] In one embodiment, the first direction adjustment device includes a first rotating element, a first sliding element, and a first linkage element. One end of the first rotating element is rotatably disposed on the first sliding element. The first linkage element includes a first linkage body and at least one first spring piece. The at least one first spring piece is connected to the first linkage body. The first linkage body is fixed to the first sliding element and is located between at least one second spring piece and the cover. When the first rotating element is rotated, the first sliding element moves relative to the first rotating element in a first direction. The first sliding element links the at least one first spring piece of the first linkage element to move in the first direction.

[0010] In one embodiment, the first rotating element and the first sliding element are a male-female mating structure.

[0011] In one embodiment, the first direction adjustment device includes a first fixing member, a first linkage body fixedly disposed on the first fixing member, the first fixing member and the first sliding element respectively disposed between at least one first spring piece, and the first fixing member fixedly disposed on the base element.

[0012] In one embodiment, the first direction adjustment device includes at least one first spring connected to the first rotating element.

[0013] In one embodiment, the second direction adjustment device includes a second rotating element, a second sliding element, and a second linkage element. One end of the second rotating element is rotatably disposed on the second sliding element. The second linkage element includes a second linkage body and at least one second spring piece. The at least one second spring piece is connected to the second linkage body. The second linkage body is fixed to the second sliding element and is located between the second sliding element and the cover. When the second rotating element rotates, the second sliding element moves relative to the second rotating element along a second direction. The second sliding element, in turn, causes the at least one second spring piece moving along the second direction to move along the second direction.

[0014] In one embodiment, the second rotating element and the second sliding element are a male-female mating structure.

[0015] In one embodiment, the second direction adjustment device includes at least one second spring connected between the base element and the second sliding element.

[0016] Based on the above, the multifunctional die production carrier disclosed herein can replace the carriers of current multi-die COS (Chip on Substrate) products on production lines. The same carrier is used from the front-end process to the back-end process, increasing efficiency. In addition to being reusable, the multifunctional die production carrier also has positioning capabilities, enabling accurate positioning of products (such as dies).

[0017] Furthermore, this disclosure uses two-directional adjustment devices to support the die against reference elements in corresponding directions to position the die.

[0018] Furthermore, the placement of the cover in this disclosure avoids and ensures that the adjustment devices in both directions can move in the corresponding directions without deviation, thereby improving the quality and efficiency of the entire die.

[0019] To make this disclosure clearer and easier to understand, specific embodiments are provided below, along with detailed descriptions in conjunction with the accompanying drawings. Simple Explanation of the Diagram

[0020] Figure 1 is a three-dimensional schematic diagram of the multifunctional grain production carrier disclosed herein. Figure 2A is a schematic diagram showing that the periphery of the grain disclosed herein is positioned by at least one spring and at least one reference element. Figure 2B is a schematic diagram showing the grains disclosed herein supported by a first-direction reference element and a second-direction reference element, respectively. Figure 3 is a perspective view of one embodiment of the subject disclosed herein. Figure 4 is a perspective view of another embodiment of the subject disclosed herein. Figure 5 is a perspective view of an embodiment of the first direction adjustment device disclosed herein disposed on the main body. Figure 6 is a schematic diagram showing the relative relationship between the first sliding element and the first fixing member disclosed herein. Figure 7A is a schematic diagram of an embodiment of the first rotating element and the first sliding element disclosed herein. Figure 7B is a schematic diagram of an embodiment of the first rotating element and the first sliding element disclosed herein. Figure 8 is a schematic diagram of the operation of the first direction adjustment device disclosed herein. Figure 9 is a schematic diagram of the operation of the cover and the first direction adjustment device disclosed herein. Figure 10 is a schematic diagram of the operation of the second direction adjustment device disclosed herein. Figure 11 is a schematic diagram of the second direction adjustment device disclosed herein. Figure 12 is a schematic diagram of a perspective of the second direction adjustment device disclosed herein. Figure 13A is a schematic diagram of an embodiment of the second rotating element and the second sliding element disclosed herein. Figure 13B is a schematic diagram of an embodiment of the second rotating element and the second sliding element disclosed herein. Implementation

[0021] The following description provides detailed examples and accompanying drawings, but these examples are not intended to limit the scope of this disclosure. Furthermore, the drawings are for illustrative purposes only and are not drawn to scale. For ease of understanding, the same elements will be designated with the same symbols in the following description.

[0022] The terms "including," "containing," and "having" used in this disclosure are all open-ended, meaning "including but not limited to."

[0023] In the description of the various embodiments, when the terms "first," "second," "third," "fourth," etc. are used to describe elements, they are only used to distinguish these elements from each other and do not limit the order or importance of these elements.

[0024] In the description of the various embodiments, the term "coupled" or "connected" may refer to two or more elements making direct physical or electrical contact with each other, or making indirect physical or electrical contact with each other. "Coupled" or "connected" may also refer to two or more elements operating or moving with each other.

[0025] In the descriptions of the various embodiments, the term "carrier" refers to a support tool used to transport, secure, or protect products moving on the process line. For COS (Chip on Substrate) products, the carrier may refer to the following types: chip tray, substrate carrier, test carrier, and transfer carrier. The chip tray is a special container used for the safe transport of chips between processes; the substrate carrier is a tool used to fix the substrate position and ensure accurate alignment; the test carrier is a special fixture used to fix COS components during the testing phase; and the transfer carrier is a tool used to transport products between different stations on the production line. The multifunctional die production carrier disclosed herein can serve as a common fixture for chip trays, substrate carriers, test carriers, and transfer carriers in the above-mentioned different process stages.

[0026] Figure 1 is a perspective view of the multifunctional die production carrier disclosed herein. Figure 2A is a schematic diagram showing that the peripheral sides of the die disclosed herein are positioned by at least one spring and at least one reference element. Figure 2B is a schematic diagram showing that the die disclosed herein rests against a first-direction reference element and a second-direction reference element. Referring to Figures 1, 2A, and 2B, the multifunctional die production carrier 100 disclosed herein is suitable for holding and positioning at least one die 50.

[0027] The multi-functional die production carrier 100 can serve as a shared fixture for different process stages in semiconductor packaging. For example, it can be shared with D / B (Die Bonding) fixtures, W / B (Wire Bonding) fixtures, or B / I (Bonding / Inspection) fixtures. The D / B (Die Bonding) fixture is a dedicated fixture for die bonding processes, and the multi-functional die production carrier 100 disclosed here can precisely fix the substrate or carrier plate, ensuring the die is accurately placed in the designated position. Similarly, the W / B (Wire Bonding) fixture is a dedicated fixture for wire bonding processes, and the multi-functional die production carrier 100 disclosed here can fix products that have completed die bonding, ensuring the gold wire is accurately connected from the die to the substrate, or it can be used for B / I (Bonding / Inspection). As a carrier for burn-in testing, this disclosure discloses a multifunctional die production carrier 100 capable of performing burn-in testing, a common reliability test in the production of electronic products or semiconductor components. Its purpose is to expose potential faults early by running the equipment for extended periods under high temperature, high load, or other accelerated aging conditions, ensuring the stability and durability of the product before formal shipment.

[0028] Therefore, the multifunctional die production carrier 100 disclosed herein can replace the carriers of current multi-die COS (Chip on Substrate) products on production lines, using the same carrier (the multifunctional die production carrier 100 disclosed herein) from the front-end process to the back-end process, increasing efficiency. In addition to being reusable, the multifunctional die production carrier 100 also has a positioning function, which can accurately position products (such as dies).

[0029] The multi-functional die production carrier 100 includes a body 110, a first orientation adjustment device 120, a second orientation adjustment device 130, and a cover 140. The body 110 and the cover 140 are combined to form a three-dimensional configuration. As shown in Figure 1, the multi-functional die production carrier 100 is a rectangular body. However, this disclosure does not limit the shape of the multi-functional die production carrier 100. The shape of the multi-functional die production carrier 100 can be adjusted according to the actual process requirements.

[0030] The body 110 includes a base element 112, a plurality of first direction reference elements 114 and a second direction reference element 116. The base element 112 is used to hold at least one die 50. The shape of the die 50 can vary according to the actual process. Here, the die 50 has an appearance, for example, a rectangle with multiple sides.

[0031] Multiple first-direction reference elements 114 are disposed along a first direction L1 and protrude from the base element 112, as shown in Figure 2B. These two first-direction reference elements 114 are disposed at a distance from each other along the first direction L1 and protrude from the surface of the base element 112 (defined here as the positioning area PA). The first-direction reference element 114 may be an elongated body, with its length direction parallel to the second direction L2, wherein the second direction L2 is perpendicular to the first direction L1. For example, if the length direction of the body 110 is taken as the X direction, the first direction L1 is parallel to the X direction, the width direction of the body 110 is taken as the Y direction, and the second direction L2 is parallel to the Y direction.

[0032] The second direction reference element 116 is disposed along the second direction L2 and protrudes from the base element 112. In this embodiment, the second direction reference element 116 is one of the protruding sides of the base element 112. One second direction reference element 116 is disposed along the second direction L2 and protrudes from the surface of the base element 112 (defined here as the positioning area PA). In this embodiment, the number of second direction reference elements 116 is one, therefore one second direction reference element 116 is disposed along the second direction L2. In other embodiments, the number of second direction reference elements 116 can be multiple, and similar to the arrangement of the first direction reference element 114, the second direction reference elements 116 can be disposed at intervals along the second direction L2. Of course, in other embodiments, the number of first direction reference elements 114 can be adjusted to one according to actual needs.

[0033] In one embodiment, the height of the first directional reference element 114 may be higher than the height of the second directional reference element 116. However, the height relationship between the first directional reference element 114 and the second directional reference element 116 can be adjusted according to actual conditions. Furthermore, as shown in Figure 2B, the first directional reference element 114 of this disclosure does not contact the second directional reference element 116. In other embodiments, one end of the first directional reference element can be extended and contact the second directional reference element according to actual needs.

[0034] A first orientation adjustment device 120 is movably disposed on a base element 112. The first orientation adjustment device 120 includes a plurality of first spring contacts SA. Taking Figures 2A and 2B as examples, the number of first spring contacts SA corresponds to the number of chips 50, and each chip 50 is located between the first spring contact SA and the first orientation reference element 114 on opposite sides along the first direction L1. The height of the chip 50 is at least higher than or equal to the height of the first orientation reference element 114. Taking Figure 2A as an example, the first spring contact SA and the first orientation reference element 114 are located on the left side 52A and the right side 52B of the chip 50, respectively, so that the first spring contact SA and the first orientation reference element 114 limit and position the chip 50 in the first direction L1. It should be noted that in this embodiment, there are multiple first orientation reference elements 114, and each chip 50 corresponds to one first orientation reference element 114 with a first spring contact SA. Therefore, the number of first orientation reference elements 114 can be equal to the number of chips 50 (or first spring contacts SA). In other embodiments, if the number of first direction reference elements is one, then these grains are supported by the same first direction reference element.

[0035] The second orientation adjustment device 130 is movably disposed on the base element 112. The second orientation adjustment device 130 includes a plurality of second spring contacts SB. Taking Figures 2A and 2B as examples, the number of second spring contacts SB corresponds to the number of chips 50, and each chip 50 is located between the corresponding second spring contact SB and the same second orientation reference element 116 on opposite sides along the second direction L2, such that the second spring contact SB and the second orientation reference element 116 constrain and position the chip 50 in the second direction L2. Taking Figure 2A as an example, the second spring contact SB and the second orientation reference element 116 are located on the upper side 52C and the lower side 52D of the chip 50, respectively. Furthermore, as shown in Figure 2B, the height of the chip 50 is at least higher than or equal to the height of the second orientation reference element 116. It should be noted that in this embodiment, the number of second-direction reference elements 116 is one, and each die 50 and the second spring SB correspond to the same second-direction reference element 116. Therefore, the number of second-direction reference elements 116 can be equal to the number of dies 50 (or the number of second springs SB). In other embodiments, if the number of second-direction reference elements is multiple, then each die and the second spring correspond to one second-direction reference element.

[0036] The cover 140 is disposed on the body 110, such that there is an accommodating space between the cover 140 and the base element 112 of the body 110. The first direction adjustment device 120 and the second direction adjustment device 130 are located in the accommodating space between the body 110 and the cover 140. The direction from the body 110 to the cover 140 can be a third direction L3, which is perpendicular to the first direction L1 and the second direction L2 respectively. For example, the length direction of the body 110 is taken as the X direction, the first direction L1 is parallel to the X direction, the width direction of the body 110 is taken as the Y direction, and the second direction L2 is parallel to the Y direction; the height direction of the body 110 is taken as the Z direction, and the third direction L3 is parallel to the Z direction.

[0037] Since the first direction adjustment device 120 and the second direction adjustment device 130 are movably disposed on the base element 112 of the main body 110, the cover 140 and the base element 112 are respectively located above and below the first direction adjustment device 120 and the second direction adjustment device 130, so as to restrict the first direction adjustment device 120 and the second direction adjustment device 130 from moving toward the cover 140. That is, the arrangement of the cover 140 can restrict and prevent the first spring SA of the first direction adjustment device 120 and the second spring SB of the second direction adjustment device 130 from moving in the third direction L3, thereby ensuring that the first spring SA and the second spring SB move in the first direction L1 and the second direction L2 respectively, and do not move toward the cover 140.

[0038] In this configuration, the first springs SA move along a first direction L1 to support the die 50 against the first direction reference element 114. It should be noted that Figure 2A shows the first springs SA and the first direction reference element 114 fixing the left side 52A and right side 52B of the die 50, thus positioning the die 50 in the first direction L1. In one embodiment, the first springs SA are a distance from the die 50 before positioning, and the die 50 is also a distance from the first direction reference element 114 before positioning; in other embodiments, the die 50 before positioning can abut against at least one of the first springs SA and the first direction reference element 114. In this way, the first spring SA moves along the first direction L1, so that the first spring SA can push the left side 52A of the die 50. After being pushed, the die 50 moves along the first direction L1 and toward the first direction reference element 114 until the right side 52B of the die 50 rests against the first direction reference element 114 as shown in Figure 2A. That is to say, the positions of the die 50 at the left side 52A and the right side 52B in the first direction L1 are restricted (or constrained) by the first spring SA and the first direction reference element 114, thus restricting the position of the die 50 in the first direction L1.

[0039] Similarly, these second springs SB move along the second direction L2 to support the die 50 against the second direction reference element 116. It should be noted that in Figure 2A, the second springs SB and the second direction reference element 116 have fixed the upper side 52C and lower side 52D of the die 50, thus positioning the die 50 in the second direction L2. Before positioning, the second springs SB will be a distance from the die 50, and the die 50 will also be a distance from the second direction reference element 116; in other embodiments, before positioning, the die 50 can abut against at least one of the second springs SB and the second direction reference element 116. In this way, the second spring SB moves along the second direction L2, so that the second spring SB can push the upper side 52C of the die 50. After being pushed, the die 50 moves along the second direction L2 and toward the second direction reference element 116 until the lower side 52D of the die 50 rests against the second direction reference element 116, as shown in Figures 2A and 2B. That is to say, the positions of the die 50 at the upper side 52C and the lower side 52D in the second direction L2 are restricted (or constrained) by the second spring SB and the second direction reference element 116, respectively, thus restricting the position of the die 50 in the second direction L2.

[0040] The aforementioned first spring SA and second spring SB in two directions push the die 50 toward the first direction reference element 114 and the second direction reference element 116 to position the die 50. At the same time, the cover 140 restricts the movement of the first spring SA and the second spring SB to prevent the first spring SA of the first direction adjustment device 120 and the second spring SB of the second direction adjustment device 130 from moving in the third direction L3. This ensures that the first spring SA and the second spring SB move the die 50 in the first direction L1 and the second direction L2, respectively, thereby improving the overall quality and efficiency of the die 50.

[0041] In one embodiment, the cover 140 may include multiple grooves RA as needed to expose at least one first spring SA and at least one second spring SB, as well as the die 50. Thus, according to process requirements, the grooves RA can be used to perform relevant process operations on the positioned dies 50. Since the size of the die 50 is getting smaller and smaller at present, the multifunctional die production carrier 100 disclosed herein provides a more accurate positioning means to meet production needs.

[0042] In one embodiment, the multifunctional die production carrier 100, after positioning the die 50, serves as a wafer carrier, substrate carrier, testing carrier, and transfer carrier. For example, the multifunctional die production carrier 100 can be mounted on an adapter board (not shown) as a shared carrier for both D / B (Die Bonding) and W / B (Wire Bonding) fixtures, allowing for the execution of related process operations without requiring replacement of different carriers for different processes. This increases efficiency and avoids die (material) damage and yield reduction caused by different carriers. The multifunctional die production carrier 100 can be mounted on the adapter board via magnetic attraction or other fixing methods. If magnetic attraction is used, magnets can be used to quickly assemble, disassemble, and position the multifunctional die production carrier 100 on the adapter board.

[0043] In another embodiment, if used as a B / I (Bonding / Inspection) fixture, the multifunctional die production carrier 100 can be detached from the adapter plate, and the upper pin plate (not shown) can be fixed together with the multifunctional die production carrier 100 as a burn-in test fixture. Therefore, the multifunctional die production carrier 100 disclosed herein can be used as a corresponding fixture according to different processes, using the same fixture (the multifunctional die production carrier 100 disclosed herein) from the front-end to the back-end processes, increasing efficiency. Furthermore, because the multifunctional die production carrier 100 also has a positioning function, it can accurately position the product (such as a die), making it usable for corresponding processes and improving process quality, such as facilitating inspection and increasing inspection speed.

[0044] In one embodiment, the cover 140 may include an upper cover plate 142 and a lower cover plate 144. The lower cover plate 144 is disposed between the upper cover plate 142 and the base element 112. The cover 140 may be provided with a groove RA according to the position of the die 50, and may be provided with a first slot RB1 and a second slot RB2 in conjunction with the first direction adjustment device 120, and a third slot RC in conjunction with the second direction adjustment device 130. The movement of the first direction adjustment device 120 and the second direction adjustment device 130 can be viewed through the groove RA, the first slot RB1, the second slot RB2 and the third slot RC, and the aligned die 50 can be processed through the groove RA. The groove RA, the first slot RB1, the second slot RB2 and the third slot RC are respectively disposed through the upper cover plate 142 and the lower cover plate 144, and are connected to the internal space of the base element 112.

[0045] Figure 3 is a perspective view of one embodiment of the main body disclosed herein from one angle. Figure 4 is a perspective view of another embodiment of the main body disclosed herein from another angle. Please refer to Figures 3 and 4 for further explanation of the disclosed body 110. In addition to including a base element 112, at least one first direction reference element 114, and at least one second direction reference element 116, the base element 112 is an elongated body with four sides. The four sides of the base element 112 are a top side 112A, a bottom side 112B, a left side 112C, and a right side 112D. The top side 112A and the bottom side 112B are opposite sides, and the direction from the top side 112A to the bottom side 112B can be the same as the second direction L2 in Figures 1, 2A, and 2B. The left side 112C and the right side 112D are opposite sides, and the direction from the left side 112C to the right side 112D can be the same as the first direction L1 in Figures 1, 2A, and 2B.

[0046] The two ends of the top side 112A are connected to the left side 112C and the right side 112D respectively. The two ends of the bottom side 112B are connected to the left side 112C and the right side 112D respectively. The two ends of the left side 112C are connected to the top side 112A and the bottom side 112B respectively. The two ends of the right side 112D are connected to the top side 112A and the bottom side 112B respectively. Thus, the top side 112A, the bottom side 112B, the left side 112C, and the right side 112D constitute the four sides of the base element 112. The second direction reference element 116 in the aforementioned Figure 1, Figure 2A, and Figure 2B is a protruding side of the bottom side 112B of the base element 112. That is, the bottom side 112B extends a certain distance as the second direction reference element 116, so that the height of the second direction reference element 116 is higher than the height of the top side 112A, the left side 112C, and the right side 112D.

[0047] In one embodiment, the base element 112 may include a positioning region PA, a setting region PB, a first-direction setting region HA1, and a second-direction setting region HA2. The positioning region PA and the setting region PB are internal regions of the base element 112, wherein the positioning region PA is adjacent to the bottom side 112B of the base element 112, and the setting region PB is located between the top side 112A of the base element 112 and the positioning region PA. As shown in Figure 2A above, the die 50, the first spring SA, and the second spring SB are located in the positioning region PA. The setting region PB may be a recessed area of ​​the base element 112, and the height of the setting region PB is lower than the height of the positioning region PA. However, this disclosure allows for adjustment of the height relationship between the setting region and the positioning region according to the actual configuration of the setting elements.

[0048] The first directional setting area HA1 has an opening on one of the right side edges 112D of the base element 112, and the axial direction of the opening in the first directional setting area HA1 is parallel to the first direction L1. The second directional setting area HA2 has an opening on one of the top side edges 112A of the base element 112, and the axial direction of the opening in the second directional setting area HA2 is parallel to the second direction L2. That is to say, the axial direction of the opening in the first directional setting area HA1 is perpendicular to the axial direction of the opening in the second directional setting area HA2.

[0049] Figure 5 is a perspective view of an embodiment of the first direction adjustment device disclosed herein disposed in the main body. Figure 6 is a schematic diagram of the relative relationship between the first sliding element and the first fixing member disclosed herein, wherein the first linkage element 126 is hidden in Figure 6 to facilitate the explanation and presentation of the arrangement relationship between the first sliding element 124, the first fixing member 128 and the first linkage element 126, the die 50, and the first spring SA, respectively. Please refer to Figures 5 and 6.

[0050] The first direction adjustment device 120 includes a first rotating element 122, a first sliding element 124, a first linkage element 126, and a first fixing member 128. The first sliding element 124, the first linkage element 126, and the first fixing member 128 are respectively located in the positioning area PA of the base element 112. The first rotating element 122 is disposed in the first direction setting area HA1 of the right side 112D of the base element 112.

[0051] One end of the first rotating element 122 is rotatably disposed on the first sliding element 124. The first linkage element 126 includes a first linkage body 1262 and a plurality of first spring pieces SA, which are respectively connected to the first linkage body 1262. In other embodiments, the number of first spring pieces SA is one. The first linkage body 1262 and the first spring pieces SA are elastic elements.

[0052] The first linkage body 1262 is located on the first sliding element 124, and the first linkage body 1262 is fixed to the first sliding element 124, so that the first rotating element 122, the first sliding element 124 and the first linkage element 126 serve as linkage components.

[0053] The first linkage body 1262 is located on the first fixing member 128, and the first fixing member 128 is fixed to the positioning area PA of the base element 112. The first linkage body 1262 is fixed to the first fixing member 128. That is, the opposite sides of the first linkage body 1262 are respectively fixed to the first sliding element 124 and the first fixing member 128. The first sliding element 124 and the first fixing member 128 are respectively disposed between these first spring pieces SA. The first sliding element 124 serves as the moving end of the first linkage body 1262, and the first fixing member 128 serves as the fixed end of the first linkage body 1262.

[0054] In this way, the first rotating element 122 rotates, causing the first sliding element 124 to move relative to the first rotating element 122 along the first direction L1. That is, the motion relationship between the first rotating element 122 and the first sliding element 124 is linear motion formed by rotational motion. This causes the first sliding element 124 to move in conjunction with the first connecting element 126. The first connecting body 1262 in the first connecting element 126 and its connected first spring piece SA move along the first direction L1. At the same time as the first connecting body 1262 and its connected first spring piece SA move along the first direction L1, the first fixing member 128 will serve as the fixing end of the first connecting body 1262, thus ensuring that the moving end of the first connecting body 1262 moves. Furthermore, since the first connecting element 126 itself is an elastic element, the first connecting body 1262 and its connected first spring piece SA can move linearly relative to the first fixing member 128 (such as along the first direction L1).

[0055] Figure 7A is a schematic diagram of one embodiment of the first rotating element and the first sliding element disclosed herein. Figure 7B is a schematic diagram of one embodiment of the first rotating element and the first sliding element disclosed herein, wherein the first sliding element 124 is hidden in Figure 7A and the first rotating element 122 is hidden in Figure 7B, in order to illustrate and present the arrangement relationship between the first rotating element 122 and the first sliding element 124. The motion relationship between the first rotating element 122 and the first sliding element 124 is linear motion formed by rotational motion, as illustrated in Figures 7A and 7B.

[0056] The first rotating element 122 includes a first driving member 1222 and a first column 1224. The first driving member 1222 is connected to the first column 1224. The first driving member 1222 is cylindrical in shape, and the user can rotate the first driving member 1222 to drive the first column 1224 to rotate. The outer diameter of the first column 1224 is smaller than the outer diameter of the first driving member 1222. In addition, the first column 1224 passes through the first direction setting area HA1 and the first sliding element 124, and the setting body 1224A in the first column 1224 is rotatably accommodated in a first receiving groove GA in the first direction setting area HA1. The first driving member 1222 is located outside the first receiving groove GA, so that when the first driving member 1222 rotates, it drives the first column 1224 to rotate, and the setting body 1224A of the first column 1224 also rotates in the first receiving groove GA.

[0057] On the other hand, the first sliding element 124 includes a first threaded hole 1242 for the first column 1224 to pass through. In this embodiment, the first rotating element 122 and the first sliding element 124 are a male-female mating structure. The first rotating element 122 is a rotating element, usually having a circular or similar shape, and can rotate around a certain axis. The first sliding element 124 is a element that can slide linearly in a certain direction (such as the first direction L1). In this embodiment, the structure between the first rotating element 122 and the first sliding element 124 is designed as a male-female mating type, so that the two can be stably connected and work together in certain operations, so that the first column 1224 acts as a bolt or a threaded column, with external threads on its surface, while the first threaded hole 1242 is a threaded hole, with internal threads on its inner surface.

[0058] The first rotating element 122 rotates, causing the first column 1224 to rotate within the first threaded hole 1242, thereby causing the first sliding element 124 to move linearly or slide. In other words, the first rotating element 122 and the first sliding element 124 achieve linear motion from rotational motion through a male-female mating structure.

[0059] Furthermore, as shown in Figures 6, 7A, and 7B, the first direction adjustment device 120 further includes a first spring 129. The number of first springs 129 can be adjusted according to actual conditions. The first springs 129 are connected to the first rotating element 122. In this embodiment, one end of the first spring 129 is threaded outside the first column 1224 of the first rotating element 122, while the other end of the first spring 129 is disposed inside the positioning area PA, so that the first spring 129 is located between the first sliding element 124 and the positioning area PA. In this way, with one end of the first spring 129 threaded outside the first column 1224 of the first rotating element 122, it can be ensured that the first driving member 1222 and the first column 1224 connected to it will not loosen during the rotation of the first rotating element 122, thereby ensuring and improving the operating efficiency of the first rotating element 122 and the first sliding element 124 forming linear motion from rotational motion.

[0060] Figure 8 is a schematic diagram of the operation of the first direction adjustment device disclosed herein. Referring to Figure 8 and in conjunction with Figures 5, 6, 7A, and 7B, the operation of the first direction adjustment device 120 disclosed herein is as follows: First, the first driving member 1222 rotates around the first rotation direction CR1. Rotating the first driving member 1222 drives the first column 1224 to rotate, causing the first rotating element 122 to rotate around the first rotation direction CR1, which can be referred to as the tightening direction. The first column 1224 rotates within the first threaded hole 1242 of the first sliding element 124, causing the first sliding element 124 to move linearly or slide. Taking Figure 8 as an example, this allows the first sliding element 124 to move along the first direction L1. The first rotating element 122 and the first sliding element 124, through a male-female mating structure, achieve the purpose of forming linear motion from rotational motion.

[0061] Next, the first sliding element 124 moves relative to the first rotating element 122 along the first direction L1, causing the first sliding element 124 to move in conjunction with the first linkage element 126. The first linkage body 1262 in the first linkage element 126 and its connected first spring SA move along the first direction L1, so that the first spring SA can push the die 50 until the die 50 rests against the first direction reference element 114.

[0062] On the other hand, when the first driving member 1222 rotates around the second rotation direction CR2, the first column 1224 is rotated by rotating the first driving member 1222, causing the first rotating element 122 to rotate around the second rotation direction CR2. The rotation direction of the second rotation direction CR2 is opposite to the first rotation direction CR1. The second rotation direction CR2 can be called the unscrewing (releasing) direction. The first column 1224 rotates in the first threaded hole 1242 in the first sliding element 124, causing the first sliding element 124 to produce linear movement or sliding. Taking Figure 8 as an example, the first sliding element 124 can move along the first releasing direction L4, where the first releasing direction L4 is parallel to the first direction L1, but the direction of the first releasing direction L4 is opposite to the direction of the first direction L1.

[0063] Next, the first sliding element 124 moves relative to the first rotating element 122 along the first release direction L4, causing the first sliding element 124 to move in conjunction with the first linkage element 126. The first linkage body 1262 in the first linkage element 126 and the first spring piece SA connected to it move along the first release direction L4, causing the first spring piece SA to move away from the position of the crystal 50.

[0064] Figure 9 is a schematic diagram of the operation of the cover and the first orientation adjustment device disclosed herein. The cover 140 is hidden in Figure 9 to illustrate and present the positional relationship between the cover 140 and the first linkage element 126 and the first spring SA in the first orientation adjustment device 120. The first linkage body 1262 is located below the cover 140, which corresponds to Figure 1. The cover 140 is located above the first orientation adjustment device 120 to prevent the first orientation adjustment device 120 from moving towards the cover 140. In other words, during the operation of the first orientation adjustment device 120, the cover 140 restricts and prevents the first spring SA of the first orientation adjustment device 120 from moving in the third direction L3, thereby ensuring that the first spring SA moves in the first direction L1 and does not move towards the cover 140, thus ensuring that the first spring SA drives the die 50.

[0065] Further, please refer to Figure 8. In one embodiment, the first linkage element 126 includes a plurality of bumps EA and a receiving groove EB. These bumps EA are spaced apart and connected to the first linkage body 1262, and these bumps EA form a receiving groove EB.

[0066] The first spring SA has a bending structure 1264, part of which is located in the receiving groove EB. Specifically, the bending structure 1264 includes a first section G1, a bending section G2, a second section G3, and a pushing section G4. One end of the first section G1 is connected to the inner side of the corresponding bump EA, and the other end of the first section G1 is connected to the bending section G2. The bending section G2 has a bend to connect the first section G1 and the second section G3. One extended end of the second section G3 is connected to the pushing section G4, which is used to push the die 50.

[0067] The first segment G1 and the second segment G3 are parallel to each other and are spaced apart along the first direction L1 or the first release direction L4, so that when the first spring SA moves along the first direction L1 or the first release direction L4, the first segment G1 and the second segment G3 have space for elastic expansion and contraction. In addition, the first segment G1 and the second segment G3 are also spaced apart from the inner side of the receiving groove EB, so that the first spring SA and the first linkage body 1262 have space for elastic expansion and contraction along the first direction L1 or the first release direction L4.

[0068] Therefore, by means of the bending structure 1264 of the first spring SA, it is possible to move along the first direction L1 or the first release direction L4. Through the elasticity of the first spring SA and the structural features of the bending structure 1264, the efficiency of the first spring SA in driving the die 50 can be improved.

[0069] Figure 10 is a schematic diagram of the operation of the second orientation adjustment device disclosed herein. Figure 11 is a schematic diagram of the second orientation adjustment device disclosed herein, wherein the first linkage element 126 is hidden in Figure 11 to facilitate the explanation and presentation of the arrangement relationship of the second linkage element 136, the die 50, and the second spring SB. Figure 12 is a schematic diagram of the second orientation adjustment device disclosed herein from one perspective to facilitate the explanation and presentation of the arrangement relationship of the second sliding element 134, the second linkage element 136, and the arrangement area PB of the base element 112. Please refer to Figures 10, 11, and 12.

[0070] The second direction adjustment device 130 includes a second rotating element 132, a second sliding element 134, a second linkage element 136, and two second springs 139. The number of second springs 139 can be adjusted according to actual conditions. The second sliding element 134 is located in the setting area PB of the base element 112, and the second linkage element 136 is located on the second sliding element 134, such that the second sliding element 134 is located between the base element 112 and the second linkage element 136. The base element 112 includes a plurality of fixing elements 117, which protrude and are set in the setting area PB. The second sliding element 134 and the second linkage element 136 cooperate with the fixing elements 117 to form a sliding groove WA. The sliding groove WA passes through the second sliding element 134 and the second linkage element 136 respectively, and the fixing element 117 is located within the sliding groove WA.

[0071] In this way, assuming the second sliding element 134 and the second linkage element 136 move along the second direction L2, the fixed element 117 will move within the sliding groove WA. Furthermore, through the design of the sliding groove WA and the fixed element 117, the linear movement of the second sliding element 134 and the second linkage element 136 along the second direction L2 or the second release direction L5 is restricted. The second release direction L5 is parallel to the second direction L2, but its direction is opposite to that of the second direction L2.

[0072] The second rotating element 132 is disposed in the second direction setting region HA2 of the top side 112A of the base element 112. One end of the second rotating element 132 is rotatably disposed on the second sliding element 134. The second linkage element 136 includes a second linkage body 1362 and a plurality of second spring pieces SB, which are respectively connected to the second linkage body 1362. In other embodiments, the number of second spring pieces SB is one. The second linkage body 1362 and the second spring pieces SB are elastic elements.

[0073] The second linkage body 1362 is located on the second sliding element 134, and the second linkage body 1362 is fixed to the second sliding element 134, so that the second rotating element 132, the second sliding element 134 and the second linkage element 136 serve as linkage components.

[0074] In this way, the second rotating element 132 rotates, causing the second sliding element 134 to move relative to the second rotating element 132 along the second direction L2. That is, the motion relationship between the second rotating element 132 and the second sliding element 134 is a linear motion formed by rotational motion. This causes the second sliding element 134 to move in conjunction with the second linkage element 136. The second linkage body 1362 in the second linkage element 136 and its connected second spring piece SB move along the second direction L2. At the same time as the second linkage body 1362 and its connected second spring piece SB move along the second direction L2, the fixing element 117 will move within the sliding groove WA, thus ensuring that the second linkage element 136 and its connected second spring piece SB move along the second direction L2. Furthermore, since the second linkage element 136 itself is an elastic element, the second linkage element 136 and its connected second spring piece SB can move linearly relative to the second rotating element 132 (such as along the second direction L2).

[0075] Figure 13A is a schematic diagram of one embodiment of the second rotating element and the second sliding element disclosed herein. Figure 13B is a schematic diagram of one embodiment of the second rotating element and the second sliding element disclosed herein, wherein the second sliding element 134 is hidden in Figure 13A to facilitate the explanation and presentation of the arrangement relationship between the second rotating element 132 and the second sliding element 134. The motion relationship between the second rotating element 132 and the second sliding element 134 is linear motion formed by rotational motion, as illustrated in Figures 13A and 13B.

[0076] The second rotating element 132 includes a second driving member 1322 and a second column 1324. The second driving member 1322 is connected to the second column 1324. The second driving member 1322 is cylindrical in shape, and the user can rotate the second driving member 1322 to drive the second column 1324 to rotate. The outer diameter of the second column 1324 is smaller than the outer diameter of the second driving member 1322. In addition, the second column 1324 passes through the second direction setting area HA2 and the second sliding element 134, and the setting body 1324A in the second column 1324 is rotatably accommodated in a second receiving groove NA in the second direction setting area HA2. The second driving member 1322 is located outside the second receiving groove NA, so that when the second driving member 1322 rotates, it drives the second column 1324 to rotate, and the setting body 1324A of the second column 1324 also rotates in the second receiving groove NA.

[0077] On the other hand, the second sliding element 134 includes a second threaded hole 1342 for the second column 1324 to pass through. In this embodiment, the second rotating element 132 and the second sliding element 134 are a male-female mating structure. The second rotating element 132 is a rotating element, usually having a circular or similar shape, and can rotate around a certain axis. The second sliding element 134 is a component that can slide linearly in a certain direction (such as the second direction L2). In this embodiment, the structure between the second rotating element 132 and the second sliding element 134 is designed as a male-female mating type, so that the two can be stably connected and work together in certain operations, so that the second column 1324 acts as a bolt or a threaded column, with external threads on its surface, while the second threaded hole 1342 is a threaded hole, with internal threads on its inner surface.

[0078] The second rotating element 132 rotates, causing the second column 1324 to rotate within the second threaded hole 1342, which in turn causes the second sliding element 134 to move linearly or slide. In other words, the second rotating element 132 and the second sliding element 134 achieve linear motion from rotational motion through a male-female mating structure.

[0079] In one embodiment, the second spring 139 is connected between the inner side of the base element 112 and the second sliding element 134. In this way, by connecting the second sliding element 134 with the second spring 139, it is ensured that the second sliding element 134 will not flip over during the rotation of the second rotating element 132, thereby ensuring and improving the operating efficiency of the second rotating element 132 and the second sliding element 134 in forming linear motion from rotational motion.

[0080] Please refer to Figure 10, and in conjunction with Figures 13A and 13B. The operation of the second direction adjustment device 130 disclosed herein is as follows: First, the second driving member 1322 is rotated around the first rotation direction DR1. Rotating the second driving member 1322 drives the second column 1324 to rotate, causing the second driving member 1322 to rotate around the first rotation direction DR1, which can be referred to as the tightening direction. The second column 1324 rotates in the second threaded hole 1342 within the second sliding element 134, causing the second sliding element 134 to produce linear movement or sliding. Taking Figures 10 and 11 as examples, this allows the second sliding element 134 to move along the second direction L2. The second rotating element 132 and the second sliding element 134 achieve the purpose of forming linear movement from rotational motion through a male-female mating structure.

[0081] Next, the second sliding element 134 moves in conjunction with the second linkage element 136. The second linkage body 1362 in the second linkage element 136 and the second spring SB connected to it move along the second direction L2, so that the second spring SB can push the die 50 until the die 50 rests against the reference element 116 in the second direction.

[0082] On the other hand, when the second driving member 1322 rotates around the second rotation direction DR2, the second driving member 1322 drives the second column 1324 to rotate, causing the second rotating element 132 to rotate around the second rotation direction DR2. The rotation direction of the second rotation direction DR2 is opposite to the first rotation direction DR1. The second rotation direction DR2 can be called the unscrewing (releasing) direction. The second column 1324 rotates in the second threaded hole 1342 in the second sliding element 134, causing the second sliding element 134 to move linearly or slide. Taking Figure 10 as an example, the second sliding element 134 can move along the second releasing direction L5, causing the second sliding element 134 to move in conjunction with the second connecting element 136. The second connecting body 1362 in the second connecting element 136 and its connected second spring SB move along the second releasing direction L5, causing the second spring SB to move away from the position of the grain 50.

[0083] Furthermore, in this embodiment, the second linkage body 1362 is located between the second sliding element 134 and the cover 140. That is, as shown in Figure 1, the cover 140 is located above the second direction adjustment device 130 to restrict the second direction adjustment device 130 from moving toward the cover 140. In other words, during the operation of the second direction adjustment device 130, the cover 140 can restrict and prevent the second spring SB of the second direction adjustment device 130 from moving in the third direction L3, thereby ensuring that the second spring SB moves in the second direction L2 and does not move toward the cover 140, thereby ensuring that the second spring SB drives the die 50.

[0084] Furthermore, the first linkage body 1262 is located between these second springs SB and the cover 140, which means that the second springs SB can also avoid being deflected when moving in the second direction L2 by means of the position of the first linkage body 1262.

[0085] Further, please refer to Figure 11. In one embodiment, the second spring SB has multiple bending structures 1364. The bending structure 1364 includes a bump FA, a first segment H1, a bending segment H2, a second segment H3, and a pushing segment H4. One end of the bump FA is connected to the second linkage body 1362, and the other end of the bump FA is connected to the first segment H1. The bending segment G2 has a bend to connect the first segment G1 and the second segment G3. One extended end of the second segment G3 is connected to the pushing segment G4, which is used to push the die 50.

[0086] The first segment H1, the bending segment H2, and the third segment H3 constitute an elastically expandable structure FB. The first segment H1 and the second segment H3 are parallel to each other and have a distance along the second direction L2 or the second release direction L5, so that when the second spring SB moves along the second direction L2 or the second release direction L5, the first segment H1 and the second segment H3 have space for elastic expansion and contraction. Furthermore, the first segment H1 and the second segment H3 are also separated from the protrusion FA and the pushing segment G4 by a distance, providing space for the second spring SB and the second linkage body 1362 to elastically expand and contract along the second direction L2 or the second release direction L5.

[0087] Therefore, by means of the bending structure 1364 of the second spring SB, it is possible to move along the second direction L2 or the second release direction L5. Through the elasticity of the second spring SB and the structural features of the bending structure 1364, the efficiency of the second spring SB in driving the die 50 can be further improved.

[0088] In summary, the multifunctional die production carrier disclosed herein can replace the carriers currently used for multi-die COS (Chip on Substrate) products on production lines. The same carrier is used from the front-end process to the back-end process, increasing efficiency. In addition to its commonality, the multifunctional die production carrier also has a positioning function, which can accurately position the product (such as a die).

[0089] Furthermore, this disclosure uses two-directional adjustment devices to support the die against reference elements in corresponding directions to position the die.

[0090] Furthermore, the placement of the cover in this disclosure avoids and ensures that the adjustment devices in both directions can move in the corresponding directions without deviation, thereby improving the quality and efficiency of the entire die.

[0091] Furthermore, this invention reveals that the elasticity and bending structure of the spring can further improve the efficiency of the spring in driving the grain.

[0092] Furthermore, this invention discloses a structure in which the rotating element and the sliding element are matched by a male and female pair, so as to achieve the purpose of generating linear motion from rotational motion.

[0093] Although this disclosure has been disclosed above with reference to embodiments, it is not intended to limit this disclosure. Anyone skilled in the art may make some modifications and refinements without departing from the spirit and scope of this disclosure. Therefore, the scope of protection of this disclosure shall be determined by the appended claims.

[0094] 50: Grain 52A: Left side 52B: Right side 52C: Top side 52D: Lower side 100: Multifunctional Grain Production Carrier 110:Ontology 112: Base component 112A: Top side 112B: Bottom side 112C: Left side 112D: Right side 114: First Direction Reference Element 116: Second Direction Reference Element 117: Fixed Components 120: First direction adjustment device 122: First rotating element 1222: First driving component 1224: First column 1224A: Setting Body 124: First sliding element 1242: First threaded hole 126: First linkage element 1262: First Linked Body 1264: Bending structure 128: First fastener 130: Second direction adjustment device 132: Second rotating element 1322: Second drive unit 1324: Second Column 1324A: Setting Body 134: Second sliding element 1342: Second threaded hole 136: Second linkage element 1362: Second Linked Body 1364: Bending structure 139: Second Spring 140: Cover 142: Top cover plate 144: Lower cover plate CR1, DR1: First rotation direction CR2, DR2: Second rotation direction EA, FA: convex blocks EB: Receptacle FB: Features a flexible and stretchable structure G1,H1: First section G2, H2: Bend Section G3, H3: Second Section G4, H4: Driving Section GA: First Receptacle HA1: First direction setting area HA2: Second direction setting area L1: First direction L2: Second direction L3: Third-party L4: First release direction L5: Second release direction NA: Second receiving slot PA: Location Area PB: Set Area RA: Tank RB1: First slot RB2: Second slot RC: Third slot SA: First fragment SB: Second fragment WA: Sliding groove

Claims

1. A multifunctional grain production carrier, adapted for at least one grain, the multifunctional grain production carrier comprising: A body includes a base element, at least one first-direction reference element, and at least one second-direction reference element, wherein the at least one first-direction reference element is disposed along a first direction and protrudes from the base element, and the at least one second-direction reference element is disposed along a second direction and protrudes from the base element, the first direction being perpendicular to the second direction, and the base element is used to hold the at least one die; a first-direction adjustment device is movably disposed on the base element, the first-direction adjustment device including at least one first spring piece, the at least one first spring piece moving along the first direction to support the at least one die against the at least one first-direction reference element; a second-direction adjustment device is movably disposed on the base element, the second-direction adjustment device including at least one second spring piece, the at least one second spring piece moving along the second direction to support the at least one die against the at least one second-direction reference element; a cover is disposed on the body, and the first-direction adjustment device and the second-direction adjustment device are located between the body and the cover.

2. The multifunctional die production carrier as claimed in claim 1, wherein the at least one first spring and the at least one second spring each have a bending structure.

3. The multifunctional die production carrier as claimed in claim 1, wherein the cover includes a plurality of grooves to expose portions of the at least one first spring and the at least one second spring.

4. The multifunctional die production carrier as claimed in claim 1, wherein the first direction adjustment device includes a first rotating element, a first sliding element, and a first linkage element, one end of the first rotating element is rotatably disposed on the first sliding element, the first linkage element includes a first linkage body and the at least one first spring, the at least one first spring is connected to the first linkage body, the first linkage body is fixed to the first sliding element, the first linkage body is located between the at least one second spring and the cover, the first rotating element rotates to cause the first sliding element to move relative to the first rotating element along the first direction, and the first sliding element links the at least one first spring of the first linkage element to move along the first direction.

5. The multifunctional die production carrier as claimed in claim 4, wherein the first rotating element and the first sliding element are a male-female mating structure.

6. The multifunctional die production carrier as claimed in claim 4, wherein the first orientation adjustment device includes a first fixing member, the first linkage body is fixed to the first fixing member, the first fixing member and the first sliding element are respectively disposed between the at least one first spring piece, and the first fixing member is fixed to the base element.

7. The multifunctional die production carrier as claimed in claim 4, wherein the first orientation adjustment device includes at least one first spring connected to the first rotating element.

8. The multifunctional die production carrier as claimed in claim 4, wherein the second direction adjustment device includes a second rotating element, a second sliding element, and a second linkage element, one end of the second rotating element is rotatably disposed on the second sliding element, the second linkage element includes a second linkage body and the at least one second spring, the at least one second spring is connected to the second linkage body, the second linkage body is fixed to the second sliding element, and the second linkage body is located between the second sliding element and the cover, the second rotating element rotates to cause the second sliding element to move relative to the second rotating element along the second direction, and the second sliding element links the at least one second spring that moves along the second direction to move along the second direction.

9. The multifunctional die production carrier as claimed in claim 8, wherein the second rotating element and the second sliding element are a male-female mating structure.

10. The multi-functional die production carrier as claimed in claim 9, wherein the second orientation adjustment device includes at least one second spring connected between the base element and the second sliding element.

Images