Die-bonding apparatus, die-bonding method and method for manufacturing semiconductor devices

Abstract

The subject matter disclosed herein is to provide a technology that facilitates the control of loading a plurality of dies in a product area. One solution is a die-bonding apparatus comprising: a wafer holding stage, a pick-up head, a stage, a rotation mechanism disposed on the pick-up head or the stage, a bonding head, a drive unit, and a control unit. The control unit is configured to perform the following: (a) picking up a die from the wafer holding stage by the pick-up head and placing the die on the stage; (b) determining, based on coordinate data pre-set before production begins, whether it is necessary to rotate the die's orientation; if rotation is necessary, rotating the die by the rotation mechanism by the rotation angle; the coordinate data includes x, y, and z coordinates representing the offset of the die's position to be bonded, and a rotation angle representing the die's orientation; (c) picking up the die from the stage by the bonding head.

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