Methods for manufacturing transport devices, semiconductor manufacturing equipment, and semiconductor devices
TW202641277APending Publication Date: 2026-10-01KIOXIA CORP
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Patent Information
- Application Number
- TW114131055
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-18
- Filing Date
- 2025-08-14
- Publication Date
- 2026-10-01
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Abstract
To prevent unnecessary contact between the semiconductor wafer and the transporter caused by warping of the semiconductor wafer, the transport device includes: a transporter for transporting the semiconductor wafer, a guide connected to the transporter and supporting the semiconductor wafer, and a component disposed below the guide that can adjust the height of the contact point between the guide and the semiconductor wafer according to the warping shape of the semiconductor wafer.
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