electrostatic chuck

TW202641281APending Publication Date: 2026-10-01TOTO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114148792
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-18
Filing Date
2025-12-12
Publication Date
2026-10-01

Smart Images

  • Figure TWG2TA001078781_001
    Figure TWG2TA001078781_001
  • Figure TWG2TA001078781_002
    Figure TWG2TA001078781_002
  • Figure TWG2TA001078781_003
    Figure TWG2TA001078781_003
Patent Text Reader

Abstract

The objective of this invention is to provide an electrostatic chuck that can alleviate stress applied to an RF electrode layer. The solution of this invention is an electrostatic chuck 10, comprising: a dielectric substrate 100 having a surface 110 for mounting a substrate W; and an RF electrode layer 140 disposed within the dielectric substrate 100. In a cross-section of the RF electrode layer 140 cut along a surface perpendicular to the opposite side 110, the void density in this electrostatic chuck 10, calculated based on the number of voids 40 per unit area, is 1500 or more voids / mm².
Need to check novelty before this filing date? Find Prior Art