Junction and parts for semiconductor manufacturing equipment

Abstract

The bonding body 20 is used to fix the base component 30 and includes: a ceramic plate 21 having a wafer mounting surface 21a; a back panel 23 bonded to the back of the ceramic plate 21; a mounting space 24 disposed on the back panel 23 and having a through hole 25 at the bottom and a nut 40 for fixing; and a moving channel 26 for inserting and removing the nut 40, which is accessible from a through opening 27 on the lower surface or side of the back panel 23. The wafer stage 10 includes: the bonding body 20, the base component 30, the nut 40, and the bolt 50.

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