electrostatic chuck

TW202641285APending Publication Date: 2026-10-01TOTO LTD
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Patent Information

Application Number
TW114141983
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-17
Filing Date
2025-10-29
Publication Date
2026-10-01

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Abstract

The present invention addresses the problem of providing an electrostatic chuck capable of suppressing delamination between a dielectric substrate and a base plate. The solution provided by the present invention is an electrostatic chuck 10, comprising: a dielectric substrate 100; a base plate 200 supporting the dielectric substrate 100; and a bonding layer 300 bonding the dielectric substrate 100 and the base plate 100. The dielectric substrate 100 is formed of a material primarily composed of aluminum oxide. The base plate 200 is formed of a material primarily composed of aluminum nitride.
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