Wafer-type sensor and imaging method

Abstract

An exemplary embodiment of the present invention provides a wafer-type sensor comprising a substrate, an imaging device, and at least one light source. The substrate includes a light-transmitting portion. The imaging device is disposed above the substrate such that it can capture an object below the substrate via the light-transmitting portion. At least one light source is disposed above the substrate such that it can irradiate light onto the object via the light-transmitting portion. The light-transmitting portion has a light-diffusing portion on the surface facing the at least one light source.

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