UV light irradiation device and installation system

TW202641310APending Publication Date: 2026-10-01SHIBAURA MECHATRONICS CORP
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Patent Information

Application Number
TW115109100
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2026-01-30
Filing Date
2026-03-12
Publication Date
2026-10-01

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Abstract

The objective of this invention is to selectively reduce the adhesion of a desired area when irradiating a resin film to which electronic components are adhered with UV light to reduce adhesion. The UV light irradiation apparatus is for irradiating a resin film to which multiple electronic components are adhered on a first surface with UV light, and includes: a support platform for supporting the resin film; a light source for irradiating a second surface of the resin film opposite to the first surface with UV light; and a shielding portion disposed between the resin film and the light source for shielding a portion of the UV light. The invention also provides an mounting system.
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