Grinding system and method of grinding semiconductor structure

TW202641311APending Publication Date: 2026-10-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
TW114117503
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-18
Filing Date
2025-05-09
Publication Date
2026-10-01

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Abstract

A grinding system includes a chuck and a grinding wheel. The chuck includes a surface that supports a semiconductor substrate. The surface of the chuck includes a first zone and a second zone. The first zone is configured to suck a first zone of the semiconductor substrate with a first suction force. The second zone is configured to suck a second zone of the semiconductor substrate with a second suction force, wherein the second suction force is different from the first suction force. The grinding wheel is configured to grind a surface of the semiconductor substrate.
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