Semiconductor device and method of manufacturing semiconductor device

Abstract

This invention provides a semiconductor device and a method for manufacturing the semiconductor device that improves the reliability of inter-wafer bonding. The semiconductor device of this embodiment includes: a first semiconductor element having a first dummy pattern and a first active pattern on its surface; and a second semiconductor element having a second dummy pattern on its surface facing the first dummy pattern and bonded to the first semiconductor element. The first dummy pattern includes a first region. The second dummy pattern includes a second region. The first region and the second region face each other. The size of the first region is larger than the average area of ​​the pads included in the first active pattern. The pattern coverage of the first region is different from that of the second region.

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