Method of extending queue time between process steps

Abstract

In a method of processing a substrate having a copper line in the substrate wherein an Ru metal cap layer is formed on a copper line disposed in the substrate and an ashless carbon oxygen barrier layer is deposited on the Ru metal cap layer to provide a substrate having a protected capped copper line. The substrate having the protected capped copper line is queued before carrying out subsequent process steps, and the ashless carbon oxygen barrier layer is removed before carrying out subsequent process steps. Protecting the capped copper line in this manner provides greater flexibility in managing substrate processing operations by permitting longer queue times before subsequent substrate processing steps are carried out, without fear that the copper line will be adversely affected by oxidation during the queue.

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