Semiconductor device and manufacturing method for semiconductor device
TW202641325APending Publication Date: 2026-10-01KIOXIA CORP
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Patent Information
- Application Number
- TW114132249
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-20
- Filing Date
- 2025-08-25
- Publication Date
- 2026-10-01
Smart Images
Figure TWG2TA001078280_001 
Figure TWG2TA001078280_002 
Figure TWG2TA001078280_003
Abstract
A semiconductor device according to an embodiment includes a circuit board, a first semiconductor element provided on the circuit board via a first adhesive layer, and a first bonding wire connecting the circuit board and the first semiconductor element. A first distance is longer than a second distance. The first distance is a length between a connection surface between the first adhesive layer and the first semiconductor element and a location on the first adhesive layer on the furthest opposite side of the circuit board. The second distance is a length between a surface of the first semiconductor element on the opposite side of the circuit board and the connection surface between the first adhesive layer and the first semiconductor element.
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